Cypress CY7C1360C, CY7C1362C manual Document History, Issue Date Orig. Description of Change

Models: CY7C1362C CY7C1360C

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CY7C1360C

CY7C1362C

Document History Page

Document Title: CY7C1360C/CY7C1362C 9-Mbit (256K x 36/512K x 18) Pipelined SRAM

Document Number: 38-05540

REV.

ECN NO.

Issue Date

Orig. of

Description of Change

Change

 

 

 

 

 

**

241690

See ECN

RKF

New data sheet

 

 

 

 

 

*A

278130

See ECN

RKF

Changed Boundary Scan order to match the B rev of these devices

 

 

 

 

Changed TQFP pkg to Lead-free TQFP in Ordering Information section

 

 

 

 

Added comment of Lead-free BG and BZ packages availability

*B

248929

See ECN

VBL

Changed ISB1 and ISB3 from DC Characteristics table as follows:

 

 

 

 

ISB1: 225 MHz -> 130 mA, 200 MHz -> 120 mA, 167 MHz -> 110 mA

 

 

 

 

ISB3: 225 MHz -> 120 mA, 200 MHz -> 110 mA, 167 MHz -> 100 mA

 

 

 

 

Changed IDDZZ to 50 mA

 

 

 

 

Added BG and BZ pkg lead-free part numbers to ordering info section

*C

323636

See ECN

PCI

Changed frequency of 225 MHz into 250 MHz

 

 

 

 

Added tCYC of 4.0 ns for 250 MHz

 

 

 

 

Changed ΘJA and ΘJC for TQFP Package from 25 and 9 °C/W to 29.41 and

 

 

 

 

6.13 °C/W respectively

 

 

 

 

Changed ΘJA and ΘJC for BGA Package from 25 and 6 °C/W to 34.1 and

 

 

 

 

14.0 °C/W respectively

 

 

 

 

Changed ΘJA and ΘJC for FBGA Package from 27 and 6 °C/W to 16.8 and

 

 

 

 

3.0 °C/W respectively

 

 

 

 

Modified address expansion as per JEDEC Standard

 

 

 

 

Removed comment of Lead-free BG and BZ packages availability

*D

332879

See ECN

PCI

Unshaded 200 and 166 MHz speed bins in the AC/DC Table and Selection

 

 

 

 

Guide

 

 

 

 

Added Address Expansion pins in the Pin Definition Table

 

 

 

 

Changed Device Width (23:18) for 119-BGA from 000000 to 101000

 

 

 

 

Added separate row for 165 -FBGA Device Width (23:18)

 

 

 

 

Modified VOL, VOH test conditions

 

 

 

 

Updated Ordering Information Table

*E

357258

See ECN

PCI

Changed from Preliminary to Final

 

 

 

 

Removed Shading on 250MHz Speed Bin in Selection Guide and AC/DC

 

 

 

 

Table

 

 

 

 

Changed ISB2 from 30 to 40 mA

 

 

 

 

Updated Ordering Information Table

*F

377095

See ECN

PCI

Modified test condition in note# 16 from VDDQ < VDD to VDDQ VDD

*G

408298

See ECN

RXU

Changed address of Cypress Semiconductor Corporation on Page# 1 from

 

 

 

 

“3901 North First Street” to “198 Champion Court”

 

 

 

 

Changed three-state to tri-state on page# 9 & page# 10

 

 

 

 

Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in

 

 

 

 

the Electrical Characteristics Table

 

 

 

 

Replaced Package Name column with Package Diagram in the Ordering

 

 

 

 

Information table

 

 

 

 

Updated Ordering Information Table

*H

501793

See ECN

VKN

Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND

 

 

 

 

Changed tTH, tTL from 25 ns to 20 ns and tTDOV from 5 ns to 10 ns in TAP

 

 

 

 

AC Switching Characteristics table.

 

 

 

 

Updated the Ordering Information table.

Document #: 38-05540 Rev. *H

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Cypress CY7C1360C, CY7C1362C manual Document History, Issue Date Orig. Description of Change