Ordering Information | Cypress CY7C1360C, CY7C1362C manual

CY7C1360C

CY7C1362C

Ordering Information

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

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Speed	Ordering Code	Package	Part and Package Type	Operating
(MHz)	Ordering Code	Diagram	Part and Package Type	Range

166	CY7C1360C-166AXC	51-85050	100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free	Commercial
			(3 Chip Enable)
	CY7C1362C-166AXC		(3 Chip Enable)
	CY7C1362C-166AXC

	CY7C1360C-166AJXC	51-85050	100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
			(2 Chip Enable)
	CY7C1362C-166AJXC		(2 Chip Enable)
	CY7C1362C-166AJXC

	CY7C1360C-166BGC	51-85115	119-ball Ball Grid Array (14 x 22 x 2.4 mm)

	CY7C1362C-166BGC

	CY7C1360C-166BGXC	51-85115	119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free

	CY7C1362C-166BGXC

	CY7C1360C-166BZC	51-85180	165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

	CY7C1362C-166BZC

	CY7C1360C-166BZXC	51-85180	165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free

	CY7C1362C-166BZXC

	CY7C1360C-166AXI	51-85050	100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free	Industrial
			(3 Chip Enable)
	CY7C1362C-166AXI		(3 Chip Enable)
	CY7C1362C-166AXI

	CY7C1360C-166AJXI	51-85050	100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free
			(2 Chip Enable)
	CY7C1362C-166AJXI		(2 Chip Enable)
	CY7C1362C-166AJXI

	CY7C1360C-166BGI	51-85115	119-ball Ball Grid Array (14 x 22 x 2.4 mm)

	CY7C1362C-166BGI

	CY7C1360C-166BGXI	51-85115	119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free

	CY7C1362C-166BGXI

	CY7C1360C-166BZI	51-85180	165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

	CY7C1362C-166BZI

	CY7C1360C-166BZXI	51-85180	165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free

	CY7C1362C-166BZXI

Document #: 38-05540 Rev. *H

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Cypress CY7C1360C, CY7C1362C manual Ordering Information

Contents

Logic Block Diagram CY7C1362C 512K x FeaturesFunctional Description1 Cypress Semiconductor Corporation Selection Guide Maximum Access Time Maximum Operating Current250 MHz 200 MHz 166 MHz Unit Maximum Cmos Standby Current Document # 38-05540 Rev. *H CY7C1360C 256K X Pin Configurations Pin Tqfp Pinout 3 Chip Enables a VersionCY7C1362C 512K x CY7C1362C Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ Version NC/576M Pin Configurations Ball BGA Pinout 2 Chip Enables with JtagNC/72M NC/36M NC/288M NC/18M Pin Configurations Ball Fbga Pinout 3 Chip Enable with JtagNC/72M Pin Definitions Single Write Accesses Initiated by Adsp Single Read AccessesSingle Write Accesses Initiated by Adsc Functional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Read Cycle, Continue Burst Next Partial Truth Table for Read/Write5Write Cycle, Continue Burst Next Read Cycle, Suspend Burst Write Cycle, Suspend Burst Test Access Port TAP Disabling the Jtag FeatureTruth Table for Read/Write5 Ieee 1149.1 Serial Boundary Scan Jtag Performing a TAP Reset TAP Controller Block DiagramTAP Registers TAP Instruction Set Idcode TAP Timing TAP DC Electrical Characteristics And Operating Conditions TAP AC Switching Characteristics Over the Operating Range103V TAP AC Test Conditions 5V TAP AC Test Conditions Scan Register Sizes Identification Register DefinitionsIdentification Codes CY7C1362C 512K x Bit# Ball ID Signal CY7C1360C 256K x Bit# Ball ID SignalBall Fbga Boundary Scan Order Name Ball BGA Boundary Scan Order CY7C1362C 512K x Bit# Ball ID Signal Name Maximum Ratings Electrical Characteristics Over the Operating Range14Operating Range Ambient Range Thermal Resistance Capacitance16AC Test Loads and Waveforms 3V I/O Test Load 250 200 166 Parameter Description Unit Min Switching Characteristics Over the Operating Range 17Min Max Set-up Times Read Cycle Timing23 Switching Waveforms BWE BWX ADV Write Cycle Timing23 CLZ Read/Write Cycle Timing23, 25 DON’T Care ZZ Mode Timing27 Ordering Information CY7C1360C CY7C1362C CY7C1360C CY7C1362C Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams 90±0.05 Ball Pbga 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change