Cypress CY7C1360C, CY7C1362C Ordering Information

CY7C1360C

CY7C1362C

Document #: 38-05540 Rev. *H Page 27 of 31

250 CY7C1360C-250AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(3 Chip Enable) Commercial

CY7C1362C-250AXC

CY7C1360C-250AJXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(2 Chip Enable)

CY7C1362C-250AJXC

CY7C1360C-250BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)

CY7C1362C-250BGC

CY7C1360C-250BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free

CY7C1362C-250BGXC

CY7C1360C-250BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

CY7C1362C-250BZC

CY7C1360C-250BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free

CY7C1362C-250BZXC

CY7C1360C-250AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(3 Chip Enable) Industrial

CY7C1362C-250AXI

CY7C1360C-250AJXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

(2 Chip Enable)

CY7C1362C-250AJXI

CY7C1360C-250BGI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)

CY7C1362C-250BGI

CY7C1360C-250BGXI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free

CY7C1362C-250BGXI

CY7C1360C-250BZI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm)

CY7C1362C-250BZI

CY7C1360C-250BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free

CY7C1362C-250BZXI

Ordering Information (continued)

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

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Contents

Main 9-Mbit (256K x 36/512K x 18) Pipelined SRAM CY7C1360C CY7C1362C Features Functional Description Logic Block Diagram CY7C1362C (512K x 18) CY7C1360C CY7C1362C Selection Guide ADDRESS REGISTER A ZZ CY7C1360C CY7C1362C Document #: 38-05540 Rev. *H Page 3 of 31 Pin Configurations CY7C1360C (256K X 36) CY7C1362C (512K x 18) 100-Pin TQFP Pinout (2 Chip Enables) (AJ Version) CY7C1362C (512K x 18) CY7C1360C (256K x 36) 119-Ball BGA Pinout (2 Chip Enables with JTAG) CY7C1360C CY7C1362C 165-Ball FBGA Pinout (3 Chip Enable with JTAG) CY7C1362C (512K x 18) CY7C1360C (256K x 36) 2345671 A B C D E F G H J K L M N P R CY7C1360C CY7C1362C Pin Definitions Functional Overview Pin Definitions Interleaved Burst Address Table (MODE = Floating or VDD) Linear Burst Address Table (MODE = GND) ZZ Mode Electrical Characteristics Truth Table Partial Truth Table for Read/Write Truth Table IEEE 1149.1 Serial Boundary Scan (JTAG) Truth Table for Read/Write TAP Controller Block Diagram S y CY7C1360C CY7C1362C TAP Timing 3.3V TAP AC Test Conditions 3.3V TAP AC Output Load Equivalent F DO T Identification Register Definitions TAP DC Electrical Characteristics And Operating Conditions Scan Register Sizes Identification Codes 165-ball FBGA Boundary Scan Order 119-ball BGA Boundary Scan Order Maximum Ratings Operating Range Electrical Characteristics Capacitance Thermal Resistance AC Test Loads and Waveforms Switching Characteristics Switching Waveforms Read Cycle Timing Write Cycle Timing Note: 24.Full width Write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW. Read/Write Cycle Timing ZZ Mode Timing Page Page Ordering Information Package Diagrams A 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) (51-85050) Package Diagrams 0.900.05 51-85115-*B 0.56 119-Ball PBGA (14 x 22 x 2.4 mm) (51-85115) Package Diagrams 51-85180-*A SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) 1.40 MAX. 51-85180-*A Document History Page