Contents
Main
18-Mbit (512K x 36/1M x 18) Pipelined DCD Sync SRAM
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Features
Functional Description
Selection Guide
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Logic Block Diagram CY7C1386DV25/CY7C1386FV25 [3] (512K x 36)
E
ADSP
BW
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Document Number: 38-05548 Rev. *E Page 3 of 30
Pin Configurations
CY7C1386DV25 (512K X 36)
CY7C1387DV25 (1M x 18)
Pin Configurations
CY7C1386FV25 (512K x 36)
CY7C1387FV25 (1M x 18)
119-Ball BGA (1 Chip Enable)
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Pin Configurations 165-Ball FBGA Pinout
CY7C1387DV25 (1M x 18)
CY7C1386DV25 (512K x 36)
2345671 A B C D E F G H J K L M N P R
CY7C1386DV25, CY7C1386FV25
Pin Definitions
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Functional Overview
Pin Definitions
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Interleaved Burst Address Table (MODE = Floating or VDD)
Linear Burst Address Table (MODE = GND)
ZZ Mode Electrical Characteristics
Truth Table
Partial Truth Table for Read/Write
Truth Table for Read/Write
IEEE 1149.1 Serial Boundary Scan (JTAG)
TAP Controller State Diagram
TAP Controller Block Diagram
Page
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
TAP Ti min g
TAP AC Test Conditions
TAP AC Output Load Equivalent
TAP AC Switching Characteristics
TAP DC Electrical Characteristics And Operating Conditions
Identification Register Definitions
Scan Register Sizes
Identification Codes
119-Ball BGA Boundary Scan Order[14, 15]
165-Ball BGA Boundary Scan Order
Maximum Ratings
Operating Range
Electrical Characteristics
Capacitance
Thermal Resistance
AC Test Loads and Waveforms
Switching Characteristics
Switching Waveforms
Read Cycle Timing
Write Cycle Timing
Read/Write Cycle Timing
ZZ Mode Timing
CY7C1386DV25, CY7C1386FV25 CY7C1387DV25, CY7C1387FV25
Ordering Information
Package Diagrams
Figure 1. 100-Pin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-85050)
A
Page
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
1.40 MAX.
51-85180-*A
Package Diagrams
NOTES: PACKAGEWEIGHT : 0.475g JEDECREFERENCE : MO-216 / DESIGN 4.6C PACKAGECODE : BB0AC
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
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NOTES : PACKAGE WEIGHT : 0.475g JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC
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