CY7C1386DV25, CY7C1386FV25
CY7C1387DV25, CY7C1387FV25
Document Number: 38-05548 Rev. *E Page 9 of 30
ZZ Mode Electrical Characteristics
Parameter Description Test Conditions Min. Max. Unit
IDDZZ Sleep mode standby current ZZ > VDD – 0.2V 80 mA
tZZS Device operation to ZZ ZZ > VDD – 0.2V 2tCYC ns
tZZREC ZZ recovery time ZZ < 0.2V 2tCYC ns
tZZI ZZ Active to sleep current This parameter is sampled 2tCYC ns
tRZZI ZZ Inactive to exit sleep current This parameter is sampled 0 ns
Truth Table [4, 5, 6, 7, 8, 9]
Operation Add. Used CE1CE2CE3ZZ ADSP ADSC ADV WRITE OE CLK DQ
Deselect Cycle, Power Down None H X X L X L X X X L-H Tri-State
Deselect Cycle, Power Down None L L X L L X X X X L-H Tri-State
Deselect Cycle, Power Down None L X H L L X X X X L-H Tri-State
Deselect Cycle, Power Down None L L X L H L X X X L-H Tri-State
Deselect Cycle, Power Down None L X H L H L X X X L-H Tri-State
Sleep Mode, Power Down None X X X H X X X X X X Tri-State
READ Cycle, Begin Burst External L H L L L X X X L L-H Q
READ Cycle, Begin Burst External L H L L L X X X H L-H Tri-State
WRITE Cycle, Begin Burst External L H L L H L X L X L-H D
READ Cycle, Begin Burst External L H L L H L X H L L-H Q
READ Cycle, Begin Burst External L H L L H L X H H L-H Tri-State
READ Cycle, Continue Burst Next X X X L H H L H L L-H Q
READ Cycle, Continue Burst Next X X X L H H L H H L-H Tri-State
READ Cycle, Continue Burst Next H X X L X H L H L L-H Q
READ Cycle, Continue Burst Next H X X L X H L H H L-H Tri-State
WRITE Cycle, Continue Burst Next X X X L H H L L X L-H D
WRITE Cycle, Continue Burst Next H X X L X H L L X L-H D
READ Cycle, Suspend Burst Current X X X L H H H H L L-H Q
READ Cycle, Suspend Burst Current X X X L H H H H H L-H Tri-State
READ Cycle, Suspend Burst Current H X X L X H H H L L-H Q
READ Cycle, Suspend Burst Current H X X L X H H H H L-H Tri-State
WRITE Cycle, Suspend Burst Current X X X L H H H L X L-H D
WRITE Cycle, Suspend Burst Current H X X L X H H L X L-H D
Notes
4. X = Don't Care, H = Logic HIGH, L = Logic LOW.
5. WRITE = L when any one or more byte write enable signals and BWE = L or GW = L. WRITE = H when all byte write enable signals, BWE, GW = H.
6. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
7. CE1, CE2, and CE3 are available only in the TQFP package. BGA package has only 2 chip selects CE1 and CE2.
8. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BWX. Writes may occur only on subsequent clocks after
the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to tri-state. OE is a don't
care for the remainder of the write cycle.
9. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is
inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW).
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