Cypress CY7C1386DV25, CY7C1386FV25, CY7C1387DV25, CY7C1387FV25 Capacitance , Thermal Resistance , AC Test Loads and Waveforms

CY7C1386DV25, CY7C1386FV25
CY7C1387DV25, CY7C1387FV25
Document Number: 38-05548 Rev. *E Page 19 of 30
Capacitance [19]
Parameter Description Test Conditions 100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz,
VDD/VDDQ = 2.5V
5 8 9 pF
CCLK Clock Input Capacitance 5 8 9 pF
CIO Input/Output Capacitance 5 8 9 pF
Thermal Resistance [19]
Parameter Description Test Conditions 100 TQFP
Package
119 BGA
Package
165 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
28.66 23.8 20.7 °C/W
ΘJC Thermal Resistance
(Junction to Case)
4.08 6.2 4.0 °C/W
AC Test Loads and Waveforms
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VT= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤1 ns ≤1 ns
(c)
2.5V IO Test Load
Note
19.Tested initially and after any design or process change that may affect these parameters.
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