CY7C604XX
Figure 11. 48-Pin (7 x 7 x 0.9 mm) QFN (001-13191)
Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving the factory. A label on the package has details about the actual bake temperature and the minimum bake time to remove this moisture. The maximum bake time is the aggregate time that the parts exposed to the bake temperature. Exceeding this exposure may degrade device reliability.
Table 21.Package Handling
Parameter | Description | Minimum | Typical | Maximum | Unit |
TBAKETEMP | Bake Temperature |
| 125 | See package label | oC |
TBAKETIME | Bake Time | See package label |
| 72 | hours |
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Document Number: | Page 27 of 30 |
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