Cypress CY7C604XX manual Thermal Impedances, Solder Reflow Peak Temperature, Ordering Information

CY7C604XX

Thermal Impedances

Package	Typical θJA (23)
16 QFN	32.69 oC/W
32 QFN(24)	19.51 oC/W
48 QFN(24)	17.68 oC/W
Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Package	Minimum Peak Temperature(25)	Maximum Peak Temperature
16 QFN	240oC	260oC
32 QFN	240oC	260oC
48 QFN	240oC	260oC
Ordering Information

Ordering Code	Package Information	Flash	SRAM	No. of GPIOs	Target Applications
CY7C60413-16LKXC	16-Pin QFN (3x3 mm)	8K	1K	13	Feature-rich Wireless Mouse
CY7C64013-16LKXCT	16-Pin QFN (3X3 mm)	8K	1K	13	Feature-rich Wireless Mouse
CY7C60445-32LQXC	32-Pin QFN	16K	1K	28	Feature-Rich Wireless Mouse
	(5x5x0.55 mm)
CY7C60445-32LQXCT	32-Pin QFN - (Tape and Reel)	16K	1K	28	Feature-Rich Wireless Mouse
	(5x5x0.55 mm)
CY7C60455-48LTXC	48-Pin QFN	16K	1K	36	Mid-Tier Wireless Keyboard
	(7x7x0.9 mm)
CY7C60455-48LTXCT	48-Pin QFN - (Tape and Reel)	16K	1K	36	Mid-Tier Wireless Keyboard
	(7x7x0.9 mm)
CY7C60456-48LTXC	48-Pin QFN	32K	2K	36	Feature-Rich Wireless
	(7x7x0.9 mm)				Keyboard
CY7C60456-48LTXCT	48-Pin QFN - (Tape and Reel)	32K	2K	36	Feature-Rich Wireless
	(7x7x0.9 mm)				Keyboard

Notes

23.TJ = TA + Power x θJA.

24.To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.

25.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.

Document Number: 001-12395 Rev *H Page 28 of 30

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