CY7C604XX
Document Number: 001-12395 Rev *H Page 28 of 30
Thermal Impedances Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Ordering Information
Package Typical θJA (23)
16 QFN 32.69 oC/W
32 QFN(24) 19.51 oC/W
48 QFN(24) 17.68 oC/W
Package Minimum Peak Temperature(25) Maximum Peak Temperature
16 QFN 240oC260oC
32 QFN 240oC260oC
48 QFN 240oC260oC
Ordering Code Package Information Flash SRAM No. of GPIOs Target Applications
CY7C60413-16LKXC 16-Pin QFN (3x3 mm) 8K 1K 13 Feature-rich Wireless Mouse
CY7C64013-16LKXCT 16-Pin QFN (3X3 mm) 8K 1K 13 Feature-rich Wireless Mouse
CY7C60445-32LQXC 32-Pin QFN
(5x5x0.55 mm) 16K 1K 28 Feature-Rich Wireless Mouse
CY7C60445-32LQXCT 32-Pin QFN - (Tape and Reel)
(5x5x0.55 mm) 16K 1K 28 Feature-Rich Wireless Mouse
CY7C60455-48LTXC 48-Pin QFN
(7x7x0.9 mm) 16K 1K 36 Mid-Tier Wireless Keyboard
CY7C60455-48LTXCT 48-Pin QFN - (Tape and Reel)
(7x7x0.9 mm) 16K 1K 36 Mid-Tier Wireless Keyboard
CY7C60456-48LTXC 48-Pin QFN
(7x7x0.9 mm) 32K 2K 36 Feature-Rich Wireless
Keyboard
CY7C60456-48LTXCT 48-Pin QFN - (Tape and Reel)
(7x7x0.9 mm) 32K 2K 36 Feature-Rich Wireless
Keyboard
Notes
23.TJ = TA + Power x θJA.
24.To achieve the thermal impedance specified for the package, solder the center thermal pad to the PCB ground plane.
25.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
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