CY7C68013A, CY7C68014A
CY7C68015A, CY7C68016A
Document #: 38-08032 Rev. *L Page 59 of 62
13. PCB Layout Recommendations
Follow these recommendations to ensure reliable high perfor-
mance operation:[24]
■Four layer impedance controlled boards are required to
maintain signal quality.
■Specify impedance targets (ask your board vendor what they
can achieve).
■To control impedance, maintain trace widths and trace spacing.
■Minimize stubs to minimize reflected signals.
■Connections between the USB connector shell and signal
ground must be near the USB connector.
■Bypass and flyback caps on VBus, near connector, are recom-
mended.
■DPLUS and DMINUS trace lengths should be kept to within 2
mm of each other in length, with preferred length of 20 to
30 mm.
■Maintain a solid ground plane under the DPLUS and DMINUS
traces. Do not allow the plane to split under these traces.
■Do not place vias on the DPLUS or DMINUS trace routing.
■Isolate the DPLUS and DMINUS traces from all other signal
traces by no less than 10 mm.
Package Diagrams (continued)
TOPVIEW
PINA1 CORNER
0.50
3.50
5.00±0.10
BOTTOMVIEW
0.10(4X)
3.50
5.00±0.10
0.50
Ø0.15MC A B
Ø0.05MC
Ø0.30±0.05(56X)
A1CORNER
-B-
-A-
1.0max
0.160~0.260
0.080C
0.45
SEATINGPLANE
0.21
0.10C
-C-
SIDEVIEW
5.00±0.10
5.00±0.10
REFERENCEJEDEC: MO-195C
PACKAGEWEIGHT: 0.02 grams
E
G
H
F
D
C
B
A
132654867856 2341
E
G
H
F
D
C
B
A
001-03901-*B
Figure 39. 56 VFBGA (5 x 5 x 1.0 mm) 0.50 Pitch, 0.30 Ball BZ56 (001-03901)
Note
24.Source for recommendations: EZ-USB FX2™PCB Design Recommendations, http://www.cypress.com/cfuploads/support/app_notes/FX2_PCB.pdf and
High-Speed USB Platform Design Guidelines, http://www.usb.org/developers/docs/hs_usb_pdg_r1_0.pdf.
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