CY7C68013A, CY7C68014A

CY7C68015A, CY7C68016A

14. Quad Flat Package No Leads (QFN) Package Design Notes

Electrical contact of the part to the Printed Circuit Board (PCB) is made by soldering the leads on the bottom surface of the package to the PCB. Hence, special attention is required to the heat transfer area below the package to provide a good thermal bond to the circuit board. Design a Copper (Cu) fill in the PCB as a thermal pad under the package. Heat is transferred from the FX2LP through the device’s metal paddle on the bottom side of the package. Heat from here is conducted to the PCB at the thermal pad. It is then conducted from the thermal pad to the PCB inner ground plane by a 5 x 5 array of via. A via is a plated through hole in the PCB with a finished diameter of 13 mil. The QFN’s metal die paddle must be soldered to the PCB’s thermal pad. Solder mask is placed on the board top side over each via to resist solder flow into the via. The mask on the top side also minimizes outgassing during the solder reflow process.

For further information on this package design refer to Appli- cation Notes for Surface Mount Assembly of Amkor's MicroLead- Frame (MLF) Packages. You can find this on Amkor's website http://www.amkor.com.

The application note provides detailed information about board mounting guidelines, soldering flow, rework process, etc.

Figure 40 shows a cross-sectional area underneath the package. The cross section is of only one via. The solder paste template should be designed to allow at least 50% solder coverage. The thickness of the solder paste template should be

5mil. Use the No Clean type 3 solder paste for mounting the part. Nitrogen purge is recommended during reflow.

Figure 41 is a plot of the solder mask pattern and Figure 42 displays an X-Ray image of the assembly (darker areas indicate solder).

Figure 40. Cross-section of the Area Underneath the QFN Package

0.017” dia

Solder Mask

Cu Fill

Cu Fill

PCB Material

Via hole for thermally connecting the QFN to the circuit board ground plane.

0.013” dia

PCB Material

This figure only shows the top three layers of the circuit board: Top Solder, PCB Dielectric, and the Ground Plane

Figure 41. Plot of the Solder Mask (White Area)

Figure 42. X-ray Image of the Assembly

Document #: 38-08032 Rev. *L

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Cypress CY7C68013, CY7C68015A, CY7C68016A, CY7C68014A manual Quad Flat Package No Leads QFN Package Design Notes
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CY7C68016A, CY7C68014A, CY7C68015A, CY7C68013 specifications

The Cypress CY7C68013, CY7C68015A, CY7C68014A, and CY7C68016A are part of Cypress Semiconductor's EZ-USB family of microcontrollers, known for their high performance and flexibility in USB applications. These devices are primarily used for USB interfacing and have gained popularity in various industries due to their robust features and capabilities.

One of the main features of the CY7C68013 is its Dual FIFO architecture, allowing for efficient data transfer between USB and the system memory. This feature optimizes throughput and reduces CPU overhead, making it an excellent choice for applications that require high-speed data exchange, such as video streaming, data acquisition, and industrial automation. The device is equipped with a USB 2.0 interface which supports full-speed operation at 12 Mbps, ensuring compatibility with a wide range of USB devices.

The CY7C68015A, a similar variant, offers additional memory options, providing users with the flexibility to select the necessary capacity for their specific applications. This part is particularly useful in scenarios that demand more users or higher data storage, making it ideal for complex USB peripherals like printers and multifunction devices. Moreover, it includes a unique capability of upgradeable firmware, ensuring that the device remains relevant and functional as technology evolves.

In contrast, the CY7C68014A stands out with its support for isochronous data transfers, making it suitable for real-time applications that require timely data delivery. This is particularly important in audio and video applications where delays can impact performance. The device incorporates advanced power management features, allowing it to operate efficiently both in low and high-power modes.

Lastly, the CY7C68016A integrates enhanced security features, positioning it as an ideal choice for applications that require data integrity and protection against unauthorized access. It supports various encryption standards and provides secure boot capabilities, making it suitable for secure environments such as financial transactions and sensitive data processing.

In summary, the CY7C68013, CY7C68015A, CY7C68014A, and CY7C68016A microcontrollers offer a versatile suite of features that cater to a wide array of USB applications. Their design emphasizes performance, flexibility, and security, making them essential components in today's rapidly evolving technology landscape. Whether in consumer electronics, industrial automation, or specialized applications, these devices provide the reliability and efficiency that engineers and developers require.
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