CY8C24123A
CY8C24223A, CY8C24423A
Document Number: 38-12028 Rev. *I Page 49 of 56
Figure 30. 28-Pin (300-Mil) Molded SOICFigure 31. 32-Pin (5x5 mm) QFN
51-85026 *D
32X = 138 MILY = 138 MIL

AD X, Y for this product is 3.53 mm, 3.53 mm (+/-0.11 mm)

TOP VIEW
C
N
BOTTOM VIEW
SEATING
PLANE
N
2
2
11
0°-12°
PIN1 ID
SIDE VIEW
0.20 R.
Ø
3.50
0.45
3.503.50
-0.20
3.50
0.50 0.42±0.18
[4X]
1. HATCH AREA IS SOLDERABLE EXPOSED PAD.2. REFERENCE JEDEC#: MO-2204. ALL DIMENSIONS ARE IN MM [MIN/MAX]NOTES:
32LD QFN 5 X 5mm PACKAGE OUTLINE
01/29/07
PART #PB-FREESTANDARDLY325. PACKAGE CODE
51-85188SEE NOTES *B
CMG
UNLESS OTHERWISE SPECIFIED
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
MATERIAL
STANDARD TOLERANCES ON:
DECIMALS
.XXX
.XXXX
.XX
-
+
-
+
+
-COMPANY CONFIDENTIAL
DESIGNED BY
APPROVED BY
APPROVED BY
DRAWN
ANGLES
-
+CHK BY
DATE
DATE
DATE
DATE
DATE
CYPRESS
TITLE
SIZE PART NO. DWG NO REV
11/01/06
DESCRIPTION3. PACKAGE WEIGHT: 0.054g
JSO
LF32

PAD

EXPOSED

SOLDERABLE

(SUBCON PUNCH TYPE PKG with 3.50 X 3.50 EPAD)
CHANGED SPEC. TITLE, CORRECTED EPAD DIMENSION
51-85188 *B
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