CY8C24123A
CY8C24223A, CY8C24423A
Document Number: 38-12028 Rev. *I Page 46 of 56

Figure 24. 8-Pin (150-Mil) SOIC

Figure 25. 20-Pin (300-Mil) Molded DIP

0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
RECTANGULAR ON MATRIX LEADFRAME
SEATING PLANE
PIN 1 ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
MAX.
0°~8°
0.016[0.406]
0.010[0.254]X 45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
0.004[0.102]
1
4
58
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms

51-85066 *C

51-85011-A
20-Lead(300-Mil) Molded DIP P5

51-85011 *A

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