CYV15G0404RB

Table 6. Package Coordinate Signal Allocation (continued)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ball

Signal Name

Signal Type

 

Ball

Signal Name

Signal Type

 

Ball

Signal Name

Signal Type

ID

 

 

 

ID

 

 

 

ID

 

 

T03

VCC

POWER

 

V15

VCC

POWER

 

Y15

VCC

POWER

 

 

 

 

 

 

 

 

 

 

 

T04

VCC

POWER

 

V16

VCC

POWER

 

Y16

VCC

POWER

 

 

 

 

 

 

 

 

 

 

 

T17

VCC

POWER

 

V17

RXDA[9]

LVTTL OUT

 

Y17

REPDOD

LVTTL OUT

 

 

 

 

 

 

 

 

 

 

 

T18

VCC

POWER

 

V18

RXDA[5]

LVTTL OUT

 

Y18

TRGCLKA–

PECL IN

 

 

 

 

 

 

 

 

 

 

 

T19

VCC

POWER

 

V19

RXDA[2]

LVTTL OUT

 

Y19

RXDA[8]

LVTTL OUT

 

 

 

 

 

 

 

 

 

 

 

T20

VCC

POWER

 

V20

RXDA[1]

LVTTL OUT

 

Y20

RXDA[7]

LVTTL OUT

 

 

 

 

 

 

 

 

 

 

 

U01

VCC

POWER

 

W01

VCC

POWER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

U02

VCC

POWER

 

W02

VCC

POWER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ordering Information

Speed

Ordering Code

Package

Package Type

Operating

Name

Range

 

 

 

 

 

 

 

 

Standard

CYV15G0404RB-BGC

BL256

256-Ball Thermally Enhanced Ball Grid Array

Commercial

 

 

 

 

 

Standard

CYV15G0404RB-BGXC

BL256

Pb-Free 256-Ball Thermally Enhanced Ball Grid Array

Commercial

 

 

 

 

 

Package Diagram

Figure 3. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256

TOP VIEW

27.00±0.13

A1 CORNER I.D.

0.20(4X)

 

 

BOTTOM VIEW (BALL SIDE)

 

A

 

Ø0.15 M C

 

 

 

 

 

 

 

 

 

 

 

 

Ø0.30 M C

A

B

 

 

 

 

24.13

 

 

 

 

Ø0.75±0.15(256X)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

18

 

16

14

12

10

8

6

4

2

 

 

 

19

17

15

13

11

9

7

5

3

1

 

 

 

 

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

 

 

 

 

B

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

 

 

D

 

 

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

 

F

 

 

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

R 2.5 Max (4X)

 

 

H

27.00±0.13

 

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

 

K

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

M

 

 

 

 

 

 

 

 

 

 

 

N

 

A

 

 

 

 

 

 

 

 

 

P

 

 

 

 

 

 

 

 

 

 

 

R

T

U

V

W

Y

A1 CORNER I.D.

12.065

24.13

1.27

1.57±0.175

0.97 REF.

0.60±0.10

C

 

B

 

 

0.15

C

26°

0.15

C

 

TYP.

 

 

SEATING PLANE

0.50 MIN.

A

0.20 MIN

TOP OF MOLD COMPOUND TO TOP OF BALLS

SIDE VIEW

51-85123-*E

 

SECTION A-A

HOTLink is a registered trademark and HOTLink II is a trademark of Cypress Semiconductor. All product and company names mentioned in this document may be the trademarks of their respective holders.

Document #: 38-02102 Rev. *C

Page 26 of 27

© Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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Cypress CYV15G0404RB Ordering Information, Package Diagram, Speed Ordering Code Package Package Type Operating, Range