Emerson MVME7100 manual Thermal Requirements, Thermally Significant Components

Thermal Requirements Hardware Preparation and Installation

2.3.3Thermal Requirements

The MVME7100 module requires a minimum air flow of 10 CFM uniformly distributed across the board, with the airflow traveling from the heat sink to the PMC2 site, when operating at a 55°C (131°F) ambient temperature.

2.3.4Thermally Significant Components

The following table summarizes components that exhibit significant temperature rises. These are the components that should be monitored in order to assess thermal performance. The table also supplies the component reference designator and the maximum allowable operating temperature.

You can find components on the board by their reference designators as shown in Figure 2-1and Figure 2-2on the next page. Versions of the board that are not fully populated may not contain some of these components.

The preferred measurement location for a component may be junction, case, or ambient as specified in the table. Junction temperature refers to the temperature measured by an on-chip thermal device. Case temperature refers to the temperature at the top, center surface of the component. Air temperature refers to the ambient temperature near the component.

Table 2-4 Thermally Significant Components

		Maximum Allowable
Reference		Component Temperature
Designator	Generic Description	in Centigrade	Measurement Location
U27, U4	Gb Ethernet Transceiver	0° to +70°	Ambient
U25, U26, U28	PCI-X/PCI-Express	-40°to +85°	Ambient
	Bridge
U22	PCI-Express Bridge	-40°to +85°	Ambient
U24	VME Bridge	0° to + 70°	Ambient
U10, U11, U12,	DDR2 SDRAM	0° to +95°	Case
U13, U14, U56,
U57, U58, U59,
U6, U60, U61,
U62, U63, U64,
U7, U8, U9
U20	MPU	0° to +105°	Junction

MVME7100 Single Board Computer Installation and Use (6806800E08A) 33