Hayes Microcomputer Products RCV56HCF manual 3 MDP, MDP Digital Electrical Characteristics

RCV56HCF PCI/CardBus Modem Designer’s Guide

3.2.3 MDP

The MDP digital electrical characteristics for the hardware interface signals are listed in Table 3-9. The MDP analog electrical characteristics for the hardware interface signals are listed in Table 3-10.

Table 3-9. MDP Digital Electrical Characteristics

Parameter		Symbol	Min.	Typ.	Max.	Units	Test Conditions1
Input High Voltage		VIH				VDC
Type IA			2.0	–	VCC + 0.3
Type IE			–	4.0	–		Note 2.
Input High Current		IIH				µA	VIN= 3.6 V, VCC = 3.6 V
Type IB			–	–	40
Input Low Voltage		VIL				VDC
Type IA			–0.3	–	0.8
Type IE			–	1.0	–		Note 2.
Input Low Current		IIL	–	–	-40	µA
Input Leakage Current		IIN			±2.5	µADC	VIN = 0 to 3.3V, VCC = 3.6 V
Output High Voltage		VOH				VDC
Type OA			2.4	–	–		ILOAD = – 100 µA
Type OB			2.4	–	–		ILOAD = 0 mA
Output Low Voltage		VOL				VDC
Type OA			–	–	0.4		ILOAD = 1.6 mA
Type OB			–	–	0.4		ILOAD = 0.8 mA
Three-State (Off) Current		ITSI			±10	µADC	VIN = 0 V to VCC
Capacitive Load		CL				pF
Types IA and ID				–	10
Type IB				–	20
Capacitive Drive		CD				pF
Types OA and OB				–	10
Circuit Type
Type IA							TTL
Type IB							TTL with pull-up
Type ID							~RES
Types OA and OB							TTL with 3-state
Notes:
1. Test Conditions:	VCC = 3.3V ±0.3V, TA = 0°C to 70°C, (unless otherwise stated).
	Output loads: Data bus (D0-D7), address bus (A0-A15), chip selects,
		DRD#, and DWR# loads = 70 pF + one TTL load.
		Other = 50 pF + one TTL load.

2. Type IE inputs are centered approximately 2.5 V and swing 1.5 VPEAK in each direction.

3. Type OE outputs provide oscillator feedback when operating with an external crystal.

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