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Hayes Microcomputer Products RCV56HCF manual Crystal Specifications Through Hole

Models: RCV56HCF

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RCV56HCF PCI/CardBus Modem Designer’s Guide
Table 4-3. Crystal Specifications - Through Hole

Characteristic	Value
Rockwell Part No.	333R44-011
Electrical
Frequency	28.224 MHz nom.
Frequency Tolerance	±50 ppm (CL = 16.5 and 19.5 pF)
Frequency Stability
vs. Temperature	±30 ppm (0°C to 70°C)
vs. Aging	±20 ppm/5 years
Oscillation Mode	Fundamental
Calibration Mode	Parallel resonant
Load Capacitance, CL	18 pF nom.
Shunt Capacitance, CO	7 pF max.
Series Resistance, R1	35 Ω max. @20 nW drive level
Drive Level	100µW correlation; 500µW max.
Operating Temperature	0°C to 70°C
Storage Temperature	–40°C to 85°C

Mechanical
Dimensions (L x W x H)	11.05 x 4.65 x 13.46 mm max.
Mounting	Through Hole
Holder Type	HC-49/U

Suggested Suppliers
	KDS America
	ILSI America
	Vectron Technologies, Inc.

Notes

1.Characteristics @ 25°C unless otherwise noted.

2.Supplier Information:

KDS America

Fountain Valley, CA 92626 (714) 557-7833

ILSI America Kirkland, WA 98033 (206) 828 - 4886

Vectron Technologies, Inc. Lowell, NH 03051

(603) 598-0074

Toyocom U.S.A., Inc. Costa Mesa, CA (714) 668-9081

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ROCKWELL PROPRIETARY INFORMATION

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Hayes Microcomputer Products RCV56HCF manual Crystal Specifications Through Hole

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary FeaturesRCV56HCF PCI/CardBus Modem Designer’s Guide Fdsp Modem Models and FunctionsMarketing Model Number1PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS General Description Technical OverviewOperating Modes Downloadable Modem Data Pump Firmware Host-Controlled Modem SoftwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S VOICE# CIDL1# Typical Signal Routing Voice ModeRelay Positions VoiceView Mode +VLS=This page is intentionally blank Establishing Data Modem Connections Data ModeFAX Class 1 Operation Error Correction and Data CompressionVOICE/AUDIO Mode MNP 10EC Enhanced Cellular ConnectionFULL-DUPLEX Speakerphone Fdsp Mode HOST-BASED Dsvd ModeVoiceview World Class Country Support DiagnosticsLOW Power Sleep Mode Caller IDHardware Interface Hardware Signal Pins and DefinitionsPIN Tqfp R6776 BUS InterfaceTqfp 11229 RCV56HCF MDPBus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# System Bus Interface Pin Signal DefinitionsPCI BUS Interface Reserved Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent DAA InterfaceMDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin TqfpPllgnd PLL MDP to Siemens PSB2186 S/T Interface MDP Pin Signal DefinitionsOverhead Signals BIF to MDP InterfacePllgnd Connection. Connect to Agnd MDP Signal Definitions ContdModem INTERCONNECT/NO Connect Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Current and Power RequirementsPCI Bus PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling Symbol Parameter Condition Min Max UnitsParameter Symbol Min Typ Max Units Test Conditions MDP Digital Electrical Characteristics3 MDP TXA1L1 10. Analog Electrical CharacteristicsName Type Characteristic Value TELINL111. Timing Serial Eeprom Interface Interface Timing and WaveformsPCI Bus Timing Serial Eeprom TimingWrite Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing 12. Timing External Device Bus InterfaceISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD713. Timing IOM-2 Interface IOM-2 InterfaceThis page is intentionally blank PC Board Layout Guidelines Component PlacementGeneral Principles Signal Routing MDP VDD, VAA PowerModem Pin Noise Characteristics Device Function Noise Source Neutral Noise SensitiveCrystal Circuit Ground Planes7 VCL1 and Vref Circuit Telephone and Local Handset Interface CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Other ConsiderationsMechanical Crystal Specifications Surface MountCharacteristic Value ElectricalCrystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package DimensionsRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Bit Offset 3124 2316 158 Hex PCI Configuration RegistersVendor ID Field Device ID FieldStatus Register Command RegisterBit Description Base Address Register CIS RAM Eeprom Configuration DataSerial Eeprom Interface Eeprom Address Copied toCommand Set Summary Functional Use Sort Command SETData Compression Command Set Summary Functional Use Sort Cont’dVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices