Package Dimensions | Hayes Microcomputer Products RCV56HCF instruction

RCV56HCF PCI/CardBus Modem Designer’s Guide

4.4 PACKAGE DIMENSIONS

The package dimensions are shown in Figure 4-1 (144-pin TQFP) and Figure 4-2 (176-pin TQFP) .

D

D1

D2

PIN 1

REF

D D1 D2

e

b

D1

A	A2
		c
	A1	L
		L
		L1

DETAIL A

D1

DETAIL A

	Millimeters		Inches*
Dim.	Min.	Max.	Min.	Max.
A	1.6 MAX		0.0630 MAX
A1	0.05	0.15	0.0020	0.0059
A2	1.4 REF		0.0551 REF
D	21.75	22.25	0.8563	0.8760
D1	20.0 REF		0.7874 REF
D2	17.5 REF		0.6890 REF
L	0.5	0.75	0.0197	0.0295
L1	1.0 REF		0.0394 REF
e	0.50 BSC		0.0197 BSC
b	0.17	0.27	0.0067	0.0106
c	0.11	0.17	0.0043	0.0067
Coplanarity	0.08 MAX		0.0031 MAX

Ref: 144-PIN TQFP (GP00-D252)

*Metric values (millimeters) should be used for PCB layout. English values (inches) are converted from metric values and may include round-off errors.

PD-TQFP-144 (040395)

Figure 4-1. Package Dimensions - 144-Pin TQFP

4-8

ROCKWELL PROPRIETARY INFORMATION

1129

Image 56

Hayes Microcomputer Products RCV56HCF manual Package Dimensions 144-Pin Tqfp

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Features Summary RCV56HCF PCI/CardBus Modem Designer’s Guide Modem Models and Functions MarketingModel Number1 Fdsp PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Operating Modes Technical OverviewGeneral Description Hardware Interfaces Host-Controlled Modem SoftwareDownloadable Modem Data Pump Firmware RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S Typical Signal Routing Voice Mode Relay Positions VoiceView Mode+VLS= VOICE# CIDL1# This page is intentionally blank Data Mode Establishing Data Modem Connections Error Correction and Data Compression VOICE/AUDIO ModeMNP 10EC Enhanced Cellular Connection FAX Class 1 Operation Voiceview HOST-BASED Dsvd ModeFULL-DUPLEX Speakerphone Fdsp Mode Diagnostics LOW Power Sleep ModeCaller ID World Class Country Support Hardware Signal Pins and Definitions Hardware Interface BUS Interface Tqfp 11229RCV56HCF MDP PIN Tqfp R6776 Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# PCI BUS Interface Bus Interface Pin Signal DefinitionsSystem Bus Interface Pin Signal Definitions Cont’d Serial Eeprom Interface NMC93C56 or EquivalentDAA Interface Reserved MDP Interface Isdn Interface NON-ISDN Models Isdn Interface Isdn Models MDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals MDP Pin Signals 144-Pin Tqfp Pin Signal Label Interface3 Type1 Pllgnd PLL MDP Pin Signal Definitions Overhead SignalsBIF to MDP Interface MDP to Siemens PSB2186 S/T Interface MDP Signal Definitions Contd Pllgnd Connection. Connect to Agnd Modem INTERCONNECT/NO Connect ELECTRICAL,SWITCHING,AND Environmental Characteristics Power and Maximum RatingsCurrent and Power Requirements Maximum Ratings PCI Bus DC Specifications for 3.3V Signaling PCI Bus AC Specifications for 3.3V SignalingSymbol Parameter Condition Min Max Units PCI Bus 3 MDP MDP Digital Electrical CharacteristicsParameter Symbol Min Typ Max Units Test Conditions 10. Analog Electrical Characteristics Name Type Characteristic ValueTELINL1 TXA1L1 Interface Timing and Waveforms PCI Bus TimingSerial Eeprom Timing 11. Timing Serial Eeprom Interface Symbol Description Min Typ Max Units Test Conditions Read External Device Bus Timing12. Timing External Device Bus Interface Write ISDNCS# DRD# DD0-DD7 ISDNCS# DWR# DD0-DD7 IOM-2 Interface 13. Timing IOM-2 Interface This page is intentionally blank General Principles Component PlacementPC Board Layout Guidelines Signal Routing Power Modem Pin Noise CharacteristicsDevice Function Noise Source Neutral Noise Sensitive MDP VDD, VAA 7 VCL1 and Vref Circuit Ground PlanesCrystal Circuit CRYSTAL/OSCILLATOR Specifications Optional ConfigurationsOther Considerations Telephone and Local Handset Interface Crystal Specifications Surface Mount Characteristic ValueElectrical Mechanical Crystal Specifications Through Hole Package Dimensions Package Dimensions 144-Pin Tqfp RCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank PCI Configuration Registers Vendor ID FieldDevice ID Field Bit Offset 3124 2316 158 Hex Bit Description Command RegisterStatus Register Base Address Register Eeprom Configuration Data Serial Eeprom InterfaceEeprom Address Copied to CIS RAM Command SET Command Set Summary Functional Use Sort Command Set Summary Functional Use Sort Cont’d Data Compression Voice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices