Power, Mdp Vdd, Vaa | Hayes Microcomputer Products RCV56HCF instruction

RCV56HCF PCI/CardBus Modem Designer’s Guide

10.Minimize the number of through-hole connections (feedthroughs/vias) on traces carrying high frequency signals.

11.Keep all signal traces away from crystal circuits.

12.Distribute high frequency signals continuously on a single trace rather than several traces radiating from one point.

13.Provide adequate clearance (e.g., 60 mil minimum) around feedthroughs in any internal planes in the DAA circuit.

14.Eliminate ground loops, which are unexpected current return paths to the power source.

4.1.4 Power

1.Identify digital power (VDD) and analog power (AVDD) supply connections.

2.Place a 10 µF electrolytic or tantalum capacitor in parallel with a ceramic 0.1 µF capacitor between power and ground at one or more points in the digital section. Place one set nearest to where power enters the PCB (edge connector or power connector) and place another set at the furthest distance from where power enters the PCB. These capacitors help to supply current surge demands by the digital circuits and prevent those surges from generating noise on the power lines that may affect other circuits.

3.For 2-layer boards, route a 200-mil wide power trace on two edges of the same side of the PCB around the border of the circuits using the power. (Note that a digital ground trace should likewise be routed on the other side of the board.)

4.Generally, route all power traces before signal traces.

Table 4-1. Modem Pin Noise Characteristics

Device	Function	Noise Source	Neutral	Noise Sensitive
MDP	VDD, VAA		13, 27, 40, 49, 63, 85-86
144-Pin TQFP	GND, DGND, AGND		16, 39, 48, 81, 99

	Crystal	87-88
	Control		17, 35, 56, 68
	Line Interface		31-32, 37, 47, 78	25-26, 29-30, 33-34,
				36

	Speaker Interface		38	28
	Serial/LED Interface	7, 10-11, 64, 66, 82	9, 12, 67, 75, 77, 79
	Host Interface	1-6, 89-98	80

	MDP Interconnect	8, 18-24, 41-46, 50-55, 59-60, 62
	Reserved or NC		14-15, 57-58, 61, 65, 69-74, 76, 83-
			84, 100

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Hayes Microcomputer Products RCV56HCF manual Power, Modem Pin Noise Characteristics, Mdp Vdd, Vaa, GND, DGND, Agnd

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary Features RCV56HCF PCI/CardBus Modem Designer’s Guide Fdsp Modem Models and FunctionsMarketing Model Number1 PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Technical Overview General DescriptionOperating Modes Host-Controlled Modem Software Downloadable Modem Data Pump FirmwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S VOICE# CIDL1# Typical Signal Routing Voice ModeRelay Positions VoiceView Mode +VLS= This page is intentionally blank Establishing Data Modem Connections Data Mode FAX Class 1 Operation Error Correction and Data CompressionVOICE/AUDIO Mode MNP 10EC Enhanced Cellular Connection HOST-BASED Dsvd Mode FULL-DUPLEX Speakerphone Fdsp ModeVoiceview World Class Country Support DiagnosticsLOW Power Sleep Mode Caller ID Hardware Interface Hardware Signal Pins and Definitions PIN Tqfp R6776 BUS InterfaceTqfp 11229 RCV56HCF MDP Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# Bus Interface Pin Signal Definitions SystemPCI BUS Interface Reserved Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent DAA Interface MDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN Models MDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin Tqfp Pllgnd PLL MDP to Siemens PSB2186 S/T Interface MDP Pin Signal DefinitionsOverhead Signals BIF to MDP Interface Pllgnd Connection. Connect to Agnd MDP Signal Definitions Contd Modem INTERCONNECT/NO Connect Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Current and Power Requirements PCI Bus PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling Symbol Parameter Condition Min Max Units MDP Digital Electrical Characteristics Parameter Symbol Min Typ Max Units Test Conditions3 MDP TXA1L1 10. Analog Electrical CharacteristicsName Type Characteristic Value TELINL1 11. Timing Serial Eeprom Interface Interface Timing and WaveformsPCI Bus Timing Serial Eeprom Timing Write Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing 12. Timing External Device Bus Interface ISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD7 13. Timing IOM-2 Interface IOM-2 Interface This page is intentionally blank Component Placement PC Board Layout GuidelinesGeneral Principles Signal Routing MDP VDD, VAA PowerModem Pin Noise Characteristics Device Function Noise Source Neutral Noise Sensitive Ground Planes Crystal Circuit7 VCL1 and Vref Circuit Telephone and Local Handset Interface CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Other Considerations Mechanical Crystal Specifications Surface MountCharacteristic Value Electrical Crystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package Dimensions RCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Bit Offset 3124 2316 158 Hex PCI Configuration RegistersVendor ID Field Device ID Field Command Register Status RegisterBit Description Base Address Register CIS RAM Eeprom Configuration DataSerial Eeprom Interface Eeprom Address Copied to Command Set Summary Functional Use Sort Command SET Data Compression Command Set Summary Functional Use Sort Cont’d Voice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices