Hayes Microcomputer Products RCV56HCF specification

RCV56HCF PCI/CardBus Modem Designer’s Guide

NOTICE

Information furnished by Rockwell International Corporation is believed to be accurate and reliable. However, no responsibility is assumed by Rockwell International for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Rockwell International other than for circuitry embodied in Rockwell products. Rockwell International reserves the right to change circuitry at any time without notice. This document is subject to change without notice.

K56flex is a trademark of Lucent Technologies and Rockwell International.

MNP 10EC and DigiTalk are trademarks of Rockwell International.

MNP is a trademark of Microcom Systems, Inc.

VoiceView is a registered trademark of Radish Communications, Inc.

Hayes is a trademark of Hayes Microcomputer Products, Inc.

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Hayes Microcomputer Products manual RCV56HCF PCI/CardBus Modem Designer’s Guide

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Features Summary RCV56HCF PCI/CardBus Modem Designer’s Guide Model Number1 Modem Models and FunctionsMarketing Fdsp PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Operating Modes Technical OverviewGeneral Description Hardware Interfaces Host-Controlled Modem SoftwareDownloadable Modem Data Pump Firmware RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S +VLS= Typical Signal Routing Voice ModeRelay Positions VoiceView Mode VOICE# CIDL1# This page is intentionally blank Data Mode Establishing Data Modem Connections MNP 10EC Enhanced Cellular Connection Error Correction and Data CompressionVOICE/AUDIO Mode FAX Class 1 Operation Voiceview HOST-BASED Dsvd ModeFULL-DUPLEX Speakerphone Fdsp Mode Caller ID DiagnosticsLOW Power Sleep Mode World Class Country Support Hardware Signal Pins and Definitions Hardware Interface RCV56HCF MDP BUS InterfaceTqfp 11229 PIN Tqfp R6776 Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# PCI BUS Interface Bus Interface Pin Signal DefinitionsSystem DAA Interface Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent Reserved MDP Interface Isdn Interface NON-ISDN Models Isdn Interface Isdn Models MDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals MDP Pin Signals 144-Pin Tqfp Pin Signal Label Interface3 Type1 Pllgnd PLL BIF to MDP Interface MDP Pin Signal DefinitionsOverhead Signals MDP to Siemens PSB2186 S/T Interface MDP Signal Definitions Contd Pllgnd Connection. Connect to Agnd Modem INTERCONNECT/NO Connect Current and Power Requirements ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Maximum Ratings Symbol Parameter Condition Min Max Units PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling PCI Bus 3 MDP MDP Digital Electrical CharacteristicsParameter Symbol Min Typ Max Units Test Conditions TELINL1 10. Analog Electrical CharacteristicsName Type Characteristic Value TXA1L1 Serial Eeprom Timing Interface Timing and WaveformsPCI Bus Timing 11. Timing Serial Eeprom Interface 12. Timing External Device Bus Interface Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing Write ISDNCS# DRD# DD0-DD7 ISDNCS# DWR# DD0-DD7 IOM-2 Interface 13. Timing IOM-2 Interface This page is intentionally blank General Principles Component PlacementPC Board Layout Guidelines Signal Routing Device Function Noise Source Neutral Noise Sensitive PowerModem Pin Noise Characteristics MDP VDD, VAA 7 VCL1 and Vref Circuit Ground PlanesCrystal Circuit Other Considerations CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Telephone and Local Handset Interface Electrical Crystal Specifications Surface MountCharacteristic Value Mechanical Crystal Specifications Through Hole Package Dimensions Package Dimensions 144-Pin Tqfp RCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Device ID Field PCI Configuration RegistersVendor ID Field Bit Offset 3124 2316 158 Hex Bit Description Command RegisterStatus Register Base Address Register Eeprom Address Copied to Eeprom Configuration DataSerial Eeprom Interface CIS RAM Command SET Command Set Summary Functional Use Sort Command Set Summary Functional Use Sort Cont’d Data Compression Voice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices