TELINL1, TXA1L1, Micm | Hayes Microcomputer Products RCV56HCF

		RCV56HCF PCI/CardBus Modem Designer’s Guide
			Table 3-10. Analog Electrical Characteristics

Name	Type		Characteristic	Value
RXA_L1,	I (DA)		Input Impedance	> 70K Ω
TELIN_L1			AC Input Voltage Range	1.1 VP-P**
			Reference Voltage	+2.5 VDC

TXA1_L1	O (DD)		Minimum Load	300 Ω
TXA2_L1			Maximum Capacitive Load	0 µF
TELOUT_L1			Output Impedance	10 Ω
			AC Output Voltage Range	2.2 VP-P
			Reference Voltage	+2.5 VDC
			DC Offset Voltage	± 200 mV

MIC_M	I (DA)		Input Impedance	> 70K Ω
MIC_V			Maximum AC Input Voltage	1.7 VP-P
			Reference Voltage*	+2.5 VDC

SPKROUT_M	O (DF)		Minimum Load	300 Ω
			Maximum Capacitive Load	0.01 µF
			Output Impedance	10 Ω
			AC Output Voltage Range	1.1 VP-P
			Reference Voltage	+2.5 VDC
			DC Offset Voltage	± 20 mV

* Reference Voltage provided internal to the device. ** Corresponds to 2.2 VP-P at Tip and Ring.

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Hayes Microcomputer Products RCV56HCF Analog Electrical Characteristics, Name Type Characteristic Value, TELINL1, TXA1L1

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary Features RCV56HCF PCI/CardBus Modem Designer’s Guide Fdsp Modem Models and FunctionsMarketing Model Number1 PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS General Description Technical OverviewOperating Modes Downloadable Modem Data Pump Firmware Host-Controlled Modem SoftwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S VOICE# CIDL1# Typical Signal Routing Voice ModeRelay Positions VoiceView Mode +VLS= This page is intentionally blank Establishing Data Modem Connections Data Mode FAX Class 1 Operation Error Correction and Data CompressionVOICE/AUDIO Mode MNP 10EC Enhanced Cellular Connection FULL-DUPLEX Speakerphone Fdsp Mode HOST-BASED Dsvd ModeVoiceview World Class Country Support DiagnosticsLOW Power Sleep Mode Caller ID Hardware Interface Hardware Signal Pins and Definitions PIN Tqfp R6776 BUS InterfaceTqfp 11229 RCV56HCF MDP Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# System Bus Interface Pin Signal DefinitionsPCI BUS Interface Reserved Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent DAA Interface MDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN Models MDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin Tqfp Pllgnd PLL MDP to Siemens PSB2186 S/T Interface MDP Pin Signal DefinitionsOverhead Signals BIF to MDP Interface Pllgnd Connection. Connect to Agnd MDP Signal Definitions Contd Modem INTERCONNECT/NO Connect Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Current and Power Requirements PCI Bus PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling Symbol Parameter Condition Min Max Units Parameter Symbol Min Typ Max Units Test Conditions MDP Digital Electrical Characteristics3 MDP TXA1L1 10. Analog Electrical CharacteristicsName Type Characteristic Value TELINL1 11. Timing Serial Eeprom Interface Interface Timing and WaveformsPCI Bus Timing Serial Eeprom Timing Write Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing 12. Timing External Device Bus Interface ISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD7 13. Timing IOM-2 Interface IOM-2 Interface This page is intentionally blank PC Board Layout Guidelines Component PlacementGeneral Principles Signal Routing MDP VDD, VAA PowerModem Pin Noise Characteristics Device Function Noise Source Neutral Noise Sensitive Crystal Circuit Ground Planes7 VCL1 and Vref Circuit Telephone and Local Handset Interface CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Other Considerations Mechanical Crystal Specifications Surface MountCharacteristic Value Electrical Crystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package Dimensions RCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Bit Offset 3124 2316 158 Hex PCI Configuration RegistersVendor ID Field Device ID Field Status Register Command RegisterBit Description Base Address Register CIS RAM Eeprom Configuration DataSerial Eeprom Interface Eeprom Address Copied to Command Set Summary Functional Use Sort Command SET Data Compression Command Set Summary Functional Use Sort Cont’d Voice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices