Manuals / Hayes Microcomputer Products / Computer Equipment / Network Card

Hayes Microcomputer Products RCV56HCF Analog Electrical Characteristics, TELINL1, TXA1L1, Micm

Models: RCV56HCF

1 70

Download 70 pages 35.45 Kb

Page 43

		RCV56HCF PCI/CardBus Modem Designer’s Guide
			Table 3-10. Analog Electrical Characteristics

Name	Type		Characteristic	Value
RXA_L1,	I (DA)		Input Impedance	> 70K Ω
TELIN_L1			AC Input Voltage Range	1.1 VP-P**
			Reference Voltage	+2.5 VDC

TXA1_L1	O (DD)		Minimum Load	300 Ω
TXA2_L1			Maximum Capacitive Load	0 µF
TELOUT_L1			Output Impedance	10 Ω
			AC Output Voltage Range	2.2 VP-P
			Reference Voltage	+2.5 VDC
			DC Offset Voltage	± 200 mV

MIC_M	I (DA)		Input Impedance	> 70K Ω
MIC_V			Maximum AC Input Voltage	1.7 VP-P
			Reference Voltage*	+2.5 VDC

SPKROUT_M	O (DF)		Minimum Load	300 Ω
			Maximum Capacitive Load	0.01 µF
			Output Impedance	10 Ω
			AC Output Voltage Range	1.1 VP-P
			Reference Voltage	+2.5 VDC
			DC Offset Voltage	± 20 mV

* Reference Voltage provided internal to the device. ** Corresponds to 2.2 VP-P at Tip and Ring.

1129

ROCKWELL PROPRIETARY INFORMATION

3-21

Image 43

Hayes Microcomputer Products RCV56HCF Analog Electrical Characteristics, Name Type Characteristic Value, TELINL1, TXA1L1

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary FeaturesRCV56HCF PCI/CardBus Modem Designer’s Guide Fdsp Modem Models and FunctionsMarketing Model Number1PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS General Description Technical OverviewOperating Modes Downloadable Modem Data Pump Firmware Host-Controlled Modem SoftwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S VOICE# CIDL1# Typical Signal Routing Voice ModeRelay Positions VoiceView Mode +VLS=This page is intentionally blank Establishing Data Modem Connections Data ModeFAX Class 1 Operation Error Correction and Data CompressionVOICE/AUDIO Mode MNP 10EC Enhanced Cellular ConnectionFULL-DUPLEX Speakerphone Fdsp Mode HOST-BASED Dsvd ModeVoiceview World Class Country Support DiagnosticsLOW Power Sleep Mode Caller IDHardware Interface Hardware Signal Pins and DefinitionsPIN Tqfp R6776 BUS InterfaceTqfp 11229 RCV56HCF MDPBus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# System Bus Interface Pin Signal DefinitionsPCI BUS Interface Reserved Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent DAA InterfaceMDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin TqfpPllgnd PLL MDP to Siemens PSB2186 S/T Interface MDP Pin Signal DefinitionsOverhead Signals BIF to MDP InterfacePllgnd Connection. Connect to Agnd MDP Signal Definitions ContdModem INTERCONNECT/NO Connect Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Current and Power RequirementsPCI Bus PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling Symbol Parameter Condition Min Max UnitsParameter Symbol Min Typ Max Units Test Conditions MDP Digital Electrical Characteristics3 MDP TXA1L1 10. Analog Electrical CharacteristicsName Type Characteristic Value TELINL111. Timing Serial Eeprom Interface Interface Timing and WaveformsPCI Bus Timing Serial Eeprom TimingWrite Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing 12. Timing External Device Bus InterfaceISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD713. Timing IOM-2 Interface IOM-2 InterfaceThis page is intentionally blank PC Board Layout Guidelines Component PlacementGeneral Principles Signal Routing MDP VDD, VAA PowerModem Pin Noise Characteristics Device Function Noise Source Neutral Noise SensitiveCrystal Circuit Ground Planes7 VCL1 and Vref Circuit Telephone and Local Handset Interface CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Other ConsiderationsMechanical Crystal Specifications Surface MountCharacteristic Value ElectricalCrystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package DimensionsRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Bit Offset 3124 2316 158 Hex PCI Configuration RegistersVendor ID Field Device ID FieldStatus Register Command RegisterBit Description Base Address Register CIS RAM Eeprom Configuration DataSerial Eeprom Interface Eeprom Address Copied toCommand Set Summary Functional Use Sort Command SETData Compression Command Set Summary Functional Use Sort Cont’dVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices