Inside Back Cover | Hayes Microcomputer Products RCV56HCF guide

NOTES

(Inside Back Cover)

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Hayes Microcomputer Products RCV56HCF manual Inside Back Cover

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Summary Features RCV56HCF PCI/CardBus Modem Designer’s Guide Marketing Modem Models and FunctionsModel Number1 Fdsp PC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Technical Overview General DescriptionOperating Modes Host-Controlled Modem Software Downloadable Modem Data Pump FirmwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S Relay Positions VoiceView Mode Typical Signal Routing Voice Mode+VLS= VOICE# CIDL1# This page is intentionally blank Establishing Data Modem Connections Data Mode VOICE/AUDIO Mode Error Correction and Data CompressionMNP 10EC Enhanced Cellular Connection FAX Class 1 Operation HOST-BASED Dsvd Mode FULL-DUPLEX Speakerphone Fdsp ModeVoiceview LOW Power Sleep Mode DiagnosticsCaller ID World Class Country Support Hardware Interface Hardware Signal Pins and Definitions Tqfp 11229 BUS InterfaceRCV56HCF MDP PIN Tqfp R6776 Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# Bus Interface Pin Signal Definitions SystemPCI BUS Interface Serial Eeprom Interface NMC93C56 or Equivalent Bus Interface Pin Signal Definitions Cont’dDAA Interface Reserved MDP Interface Isdn Interface Isdn Models Isdn Interface NON-ISDN Models MDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals Pin Signal Label Interface3 Type1 MDP Pin Signals 144-Pin Tqfp Pllgnd PLL Overhead Signals MDP Pin Signal DefinitionsBIF to MDP Interface MDP to Siemens PSB2186 S/T Interface Pllgnd Connection. Connect to Agnd MDP Signal Definitions Contd Modem INTERCONNECT/NO Connect Power and Maximum Ratings ELECTRICAL,SWITCHING,AND Environmental CharacteristicsCurrent and Power Requirements Maximum Ratings PCI Bus AC Specifications for 3.3V Signaling PCI Bus DC Specifications for 3.3V SignalingSymbol Parameter Condition Min Max Units PCI Bus MDP Digital Electrical Characteristics Parameter Symbol Min Typ Max Units Test Conditions3 MDP Name Type Characteristic Value 10. Analog Electrical CharacteristicsTELINL1 TXA1L1 PCI Bus Timing Interface Timing and WaveformsSerial Eeprom Timing 11. Timing Serial Eeprom Interface External Device Bus Timing Symbol Description Min Typ Max Units Test Conditions Read12. Timing External Device Bus Interface Write ISDNCS# DWR# DD0-DD7 ISDNCS# DRD# DD0-DD7 13. Timing IOM-2 Interface IOM-2 Interface This page is intentionally blank Component Placement PC Board Layout GuidelinesGeneral Principles Signal Routing Modem Pin Noise Characteristics PowerDevice Function Noise Source Neutral Noise Sensitive MDP VDD, VAA Ground Planes Crystal Circuit7 VCL1 and Vref Circuit Optional Configurations CRYSTAL/OSCILLATOR SpecificationsOther Considerations Telephone and Local Handset Interface Characteristic Value Crystal Specifications Surface MountElectrical Mechanical Crystal Specifications Through Hole Package Dimensions 144-Pin Tqfp Package Dimensions RCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Vendor ID Field PCI Configuration RegistersDevice ID Field Bit Offset 3124 2316 158 Hex Command Register Status RegisterBit Description Base Address Register Serial Eeprom Interface Eeprom Configuration DataEeprom Address Copied to CIS RAM Command Set Summary Functional Use Sort Command SET Data Compression Command Set Summary Functional Use Sort Cont’d Voice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices