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Hayes Microcomputer Products RCV56HCF Crystal Specifications Surface Mount, Characteristic Value

Models: RCV56HCF

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RCV56HCF PCI/CardBus Modem Designer’s Guide

Table 4-2. Crystal Specifications - Surface Mount

Characteristic

Value

Rockwell Part No.	5333R02-020
Electrical
Frequency	28.224 MHz nom.
Frequency Tolerance	±50 ppm (CL = 16.5 and 19.5 pF)
Frequency Stability
vs. Temperature	±35 ppm (0°C to 70°C)
vs. Aging	±15 ppm/4 years
Oscillation Mode	Fundamental
Calibration Mode	Parallel resonant
Load Capacitance, CL	18 pF nom.
Shunt Capacitance, CO	7 pF max.
Series Resistance, R1	60 Ω max. @20 nW drive level
Drive Level	100µW correlation; 300µW max.
Operating Temperature	0°C to 70°C
Storage Temperature	–40°C to 85°C

Mechanical
Dimensions (L x W x H)	7.5 x 5.2 x 1.3 mm max.
Mounting	SMT
Holder Type	None

Suggested Suppliers
	KDS America
	ILSI America
	Vectron Technologies, Inc.

Notes

1.Characteristics @ 25°C unless otherwise noted.

2.Supplier Information:

KDS America

Fountain Valley, CA 92626 (714) 557-7833

ILSI America Kirkland, WA 98033 (206) 828 - 4886

Vectron Technologies, Inc. Lowell, NH 03051

(603) 598-0074

Toyocom U.S.A., Inc. Costa Mesa, CA (714) 668-9081

4-6

ROCKWELL PROPRIETARY INFORMATION

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Hayes Microcomputer Products RCV56HCF Crystal Specifications Surface Mount, Characteristic Value, Electrical, Mechanical

Contents

RCV56HCF RCV56HCF PCI/CardBus Modem Designer’s Guide Table of Contents Command SET Rockwell Proprietary Information List of Figures List of Tables Features SummaryRCV56HCF PCI/CardBus Modem Designer’s Guide Model Number1 Modem Models and FunctionsMarketing FdspPC Software RCV56HCF Hardware Configuration Block Diagram Data Pump BUS Technical Overview General DescriptionOperating Modes Host-Controlled Modem Software Downloadable Modem Data Pump FirmwareHardware Interfaces RCV56HCF PCI/CardBus Modem Designer’s Guide Typical Audio Signal Interface U.S +VLS= Typical Signal Routing Voice ModeRelay Positions VoiceView Mode VOICE# CIDL1#This page is intentionally blank Data Mode Establishing Data Modem ConnectionsMNP 10EC Enhanced Cellular Connection Error Correction and Data CompressionVOICE/AUDIO Mode FAX Class 1 OperationHOST-BASED Dsvd Mode FULL-DUPLEX Speakerphone Fdsp ModeVoiceview Caller ID DiagnosticsLOW Power Sleep Mode World Class Country SupportHardware Signal Pins and Definitions Hardware InterfaceRCV56HCF MDP BUS InterfaceTqfp 11229 PIN Tqfp R6776Bus Interface 176-Pin Tqfp Hardware Interface Signals Bus Interface 176-Pin Tqfp Pin Signals Pin Signal Label Type1 Interface DEVSEL# Bus Interface Pin Signal Definitions SystemPCI BUS Interface DAA Interface Bus Interface Pin Signal Definitions Cont’dSerial Eeprom Interface NMC93C56 or Equivalent ReservedMDP Interface Isdn Interface NON-ISDN Models Isdn Interface Isdn ModelsMDP 144-Pin Tqfp Hardware Interface Signals MDP 144-Pin Tqfp Pin Signals MDP Pin Signals 144-Pin Tqfp Pin Signal Label Interface3 Type1Pllgnd PLL BIF to MDP Interface MDP Pin Signal DefinitionsOverhead Signals MDP to Siemens PSB2186 S/T InterfaceMDP Signal Definitions Contd Pllgnd Connection. Connect to AgndModem INTERCONNECT/NO Connect Current and Power Requirements ELECTRICAL,SWITCHING,AND Environmental CharacteristicsPower and Maximum Ratings Maximum RatingsSymbol Parameter Condition Min Max Units PCI Bus DC Specifications for 3.3V SignalingPCI Bus AC Specifications for 3.3V Signaling PCI BusMDP Digital Electrical Characteristics Parameter Symbol Min Typ Max Units Test Conditions3 MDP TELINL1 10. Analog Electrical CharacteristicsName Type Characteristic Value TXA1L1Serial Eeprom Timing Interface Timing and WaveformsPCI Bus Timing 11. Timing Serial Eeprom Interface12. Timing External Device Bus Interface Symbol Description Min Typ Max Units Test Conditions ReadExternal Device Bus Timing WriteISDNCS# DRD# DD0-DD7 ISDNCS# DWR# DD0-DD7IOM-2 Interface 13. Timing IOM-2 InterfaceThis page is intentionally blank Component Placement PC Board Layout GuidelinesGeneral Principles Signal Routing Device Function Noise Source Neutral Noise Sensitive PowerModem Pin Noise Characteristics MDP VDD, VAAGround Planes Crystal Circuit7 VCL1 and Vref Circuit Other Considerations CRYSTAL/OSCILLATOR SpecificationsOptional Configurations Telephone and Local Handset InterfaceElectrical Crystal Specifications Surface MountCharacteristic Value MechanicalCrystal Specifications Through Hole Package Dimensions Package Dimensions 144-Pin TqfpRCV56HCF PCI/CardBus Modem Designer’s Guide This page is intentionally blank Device ID Field PCI Configuration RegistersVendor ID Field Bit Offset 3124 2316 158 HexCommand Register Status RegisterBit Description Base Address Register Eeprom Address Copied to Eeprom Configuration DataSerial Eeprom Interface CIS RAMCommand SET Command Set Summary Functional Use SortCommand Set Summary Functional Use Sort Cont’d Data CompressionVoice Commands Command Set Summary Alphanumeric Sort Command Set Summary Alphanumeric Sort Cont’d RCV56HCF PCI/CardBus Modem Designer’s Guide Inside Back Cover Regional Sales Offices