HP Book 800CT manual Heat Transfer Disk and Keyboard Support Insulator

Heat Transfer Disk

(The following information applies to F1360 units only.)

With each replacement of the CPU, a new Heat Transfer Disk must be placed on the underside of the Top Case. See Figure 38. Simply pull back the Keyboard Support Insulator, remove the old Heat Transfer Disk, center the new Heat Transfer Disk in the indentation and reposition the Insulator. Ensure the rectangle opening in the Insulator is positioned squarely over the Heat Transfer Disk so that the edges of the Insulator opening retain the disk.

Keyboard Support Insulator

(p/n F1360-20004)

Heat Transfer Disk

(p/n F1360-20006)

Figure 38 - Heat Transfer Disk and Keyboard Support Insulator

The heat generated by the CPU must be transferred through the CPU Thermal Coupling to the Heat Transfer Disk. See Figure 39. The material used to facilitate the heat transfer is a paraffin- based thermally conductive wax. When heated, the wax on the disk melts and flows to fill in thermally restrictive air gaps between the Top Case and the CPU.

CPU Thermal Coupling

Figure 39 - CPU Thermal

Coupling

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