HP Designjet L26500/L28500 Edge B8K59A manual 53

Substrate Warm-up Warm-up Warm-up				Cool-	Cool-	Cool-	Cool-	Minimum
family	drying	curing	curing	down	down	down	down	drying
	temperat	temperat	temperat	drying	drying	curing	curing	power
	ure offset	ure	ure offset	temperat	temperat	temperat	temperat
				ure	ure offset	ure	ure offset
Low-temp.	10	80	0	75	0	85	0	0
Mesh	10	85	0	80	0	85	0	0.7

The various settings mentioned above are described below.

Setting	Description	If too low	If too high
Warm-up drying	The base temperature that the	This setting is determined by the RIP. You cannot change it.
temperature	substrate in the print zone must
	reach before printing starts.
Warm-up drying	This offset is added to the base	Bleeding or coalescence may	A longer time to start printing is
temperature offset	warm-up drying temperature,	appear in the first 200-300 mm	required. Vertical banding or ink
	and the total is displayed in the	of the print.	smears may occur.
	front panel while the printer is
	preparing to print.
Warm-up curing	The base temperature that the	This setting is determined by the printer. You cannot change it.
temperature	substrate in the curing zone must
	reach before printing starts.
Warm-up curing	This offset is added to the base	The beginning of the print is not	Substrate degradation (blisters,
temperature offset	warm-up curing temperature,	fully dry, or looks oily.	adhesive detachment) at the
	and the total is displayed in the		beginning of the print.
	front panel while the printer is
	preparing to print.
Cool-down drying	The base temperature at which	This setting is determined by the printer. You cannot change it.
temperature	the substrate can be under the
	drying module without being
	damaged. At the end of a job,
	the substrate is not stopped until
	this temperature is reached.
Cool-down drying	This offset is added to the base	A long time is needed to finish	The substrate at the beginning of
temperature offset	cool-down drying temperature.	the print.	the next print may be damaged,
			because it has stopped moving
			under too high a temperature.
			This case is uncommon.
Cool-down curing	The base temperature at which	This setting is determined by the printer. You cannot change it.
temperature	the substrate can be under the
	curing module without being
	damaged. At the end of a job,
	the substrate is not stopped until
	this temperature is reached.
Cool-down curing	This offset is added to the base	A long time is needed to finish	The end of the print may be
temperature offset	cool-down curing temperature.	the print.	damaged if the cutter is
			disabled.
Minimum drying	The minimum power applied in	A heavily inked area that comes	The substrate is damaged in
power	the drying module while	after a lightly inked area will	blank or lightly inked areas of
	printing, so the substrate does	have bleeding or coalescence	the print, especially with a high
	not cool too much in lightly	defects.	number of passes.
	inked areas.

Substrate settings

ENWW Add a new substrate 47