10 CMX58886CX cpuModule BDM-610000050 Rev A
Specifications

Physical Characteristics

•Dimensions: 117mm L x 97mm W x 15mm H (4.6"L x 3.8"W x 0.6"H)
•Weight: Approximately 0.19 Kg (0.40 lbs.)
•PCB: 14-layer, mixed surface-mount and thru-hole

Power Consum ption

Exact power consumption depends on the actual application. Table2 lists power consumption for typical
configurations and clock speeds.

Operating Conditions

Tabl e 2 cpu Mo dul e P owe r C ons um pti on

Module Speed RAM Power, typ. Power, Max.
CMX58886CX 1.0 GHz 256 or 512 MB 10.9 W 12.2 W

Table 3 Operating Conditions

Symbol Parameter Tes t C on di ti on Min. Max.
VCC5 5V Supply Voltage 4.75V 5.25V
VCC3 3.3V Supply Voltage 3.1V1
1. Because the cpuModule has an onboard +3.3V supply, an external +3.3V supply is not required.
However, if a +3.3 V supply is installed in the system to power PC/104-Plus or PCI-104 expansion
boards, it will be monitored by the CPU at power up.
n/a
VCC12 12V Supply Voltage n/a2
2. The 12V and -12V rails are not used by the cpuModule. They are only connected between the
bus connector and the power connector. Any requirements on these signals are driven by other
components in the system.
n/a
VCC-12 -12V Supply Voltage n/a2n/a
VCCSTBY 5V Standby Voltage3
3. 5V Standby is used to power the board when the main supply is turned off (power down modes
S3-S5). It is not required for board operation.
4.75V 5.25V
ICCSTBY 5V Standby Current3-500mA
Ta Ambient Operating
Tempe ratu re
Standard4
4. With proper cooling (See Thermal Management on page 65)
-40C +75C
Ta Ambient Operating
Tempe ratu re
Extended4-40C +85C
Ts Storage Temperature -40C +85C
Rh Humidity Non-Condensing 0 90%
MTBF Mean Time Before
Failure
23 C 110,000
hours