Device Identification, 82540EP Product Name, Yyww

Networking Silicon — 82540EP

5.0Package and Pinout Information

This section describes the 82540EP device, manufactured in a 196-lead ball grid array measuring 15mm X 15mm. External product identification is shown in Figure 10. The nominal ball pitch is 1mm. The pin number-to-signal mapping is indicated beginning with Table 19.

5.1Device Identification

Figure 10. 82540EP Device Identification Markings

RC82540EP

YYWW © 'ZZ

Tnnnnnnnn

Country

82540EP	Product Name
YYWW	Date Code
Tnnnnnnnn	Lot Trace Code
(c)’ZZ	Copyright Information
Country	Country of Origin Assembly

NOTE: “• “indicates the location of pin 1. It is not an actual mark on the device

Datasheet

Page 33

Image 33

Intel manual Device Identification, 82540EP Product Name, Yyww, Date Code

Contents

Revision April 82540EP Gigabit Ethernet Controller Datasheet Date Revision 82540EP Networking Silicon Contents 82540EP Networking Silicon Introduction TX MAC MdioRX MAC Acpi LED Document Scope Reference DocumentsProduct Code 82540EP Networking Silicon MAC Specific Features PCI FeaturesFeatures Benefits Application flexibility for LAN on Motherboard HostOffloading PHY Specific Features A server management processor Manageability Features Technology Features Additional Device Features PCI Address, Data and Control Signals Signal Type DefinitionsSymbol Type Name and Function PCI Bus Interface FRAME# STS PARIRDY# STS TRDY# STS Interrupt Signal Arbitration SignalsSystem Signals Error Reporting Signals Power Management Signals Eeprom and Serial Flash Interface SignalsImpedance Compensation Signals SMB Signals Miscellaneous Signals LED SignalsOther Signals Analog XTAL1XTAL2 Power Supply Connections Test Interface SignalsDigital Supplies Analog Supplies Ground and No Connects Control SignalsGND CTRL15 Recommended Operating Conditions Absolute Maximum RatingsAbsolute Maximum Ratingsa Recommended Operating Conditions a Sheet 1 DC Characteristics DC SpecificationsPower Specifications D0a Recommended Operating Conditions a Sheet 2 Power Specifications D3cold Power Specifications Dr UninitializedPower Specifications Complete Subsystem O Characteristics Symbol Parameter Condition Min Typ Max= V SS AC Characteristics Symbol Parameter a PCI 66 MHz PCI 33 MHz Units Min Max Timing Specifications PCI Bus InterfacePCI Bus Interface Clock Parameters Tcyc PCI Bus Interface Timing Parameters Symbol Parameter PCI 66MHz PCI 33 MHz Units Min Max PCI Bus Interface Timing Measurement Conditions Symbol Parameter PCI 66 MHz UnitVTH VTL Pin Inch max Point 1kΩ 10 pFInch max Point 50 pF Link Interface Timing Eeprom InterfaceRise and Fall Times 82540EP Product Name Device IdentificationYyww Date Code Package Information Datasheet Thermal Characteristics Thermal SpecificationsSymbol Parameter Value at specified airflow m/s Units Thermal resistance, junction-to-ambient Pinout Information Impedance Compensation Signals Power Management SignalsSMB Signals Eeprom and Serial Flash Interface Signals Test Interface Signals PHY SignalsDigital Power Signals Analog Power Signals Signal Names in Pin Order Sheet 1 Grounds and No Connect SignalsSignal Name Pin Lanpwrgood Smbclk RST# SMBALRT# Signal Names in Pin Order Sheet 2M66EN REQ# CBE3# CLKRUN# Smbdata GND Signal Names in Pin Order Sheet 3 IRDY# FRAME# CBE2# GNDCLK VIO TRDY# Zpcomp Signal Names in Pin Order Sheet 4 STOP# INTA# DEVSEL# ZncompPAR PERR# GNT# Signal Names in Pin Order Sheet 5 CBE1#CBE0# PCIAD5 GND PCIAD1 Clkview FLCE# Eesk PCIAD9 PCIAD7 PCIAD4 Signal Names in Pin Order Sheet 6PCIAD8 PCIAD6 PCIAD3 PCIAD2 Eecs GND Flso Eedi Vddo P12 C D E F G H J K L M N P Visual Pin Reference

5.0Package and Pinout Information

5.1Device Identification

Figure 10. 82540EP Device Identification Markings

YYWW © 'ZZ

Tnnnnnnnn

Country

82540EP

Product Name

YYWW

Date Code

Tnnnnnnnn

Lot Trace Code

(c)’ZZ

Copyright Information

Country

Datasheet