Package Information, Datasheet | Intel 82540EP guide

82540EP — Networking Silicon

5.2Package Information

The 82540EP device is a 196-lead ball grid array (TFBGA) measuring 15 mm2. The package dimensions are detailed in Figure 11. The nominal ball pitch is 1 mm.

	Figure 11. 82540EP Mechanical Specifications
28	Datasheet

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Intel 82540EP manual Package Information, Datasheet

Contents

82540EP Gigabit Ethernet Controller Revision April Datasheet Date Revision 82540EP Networking Silicon Contents 82540EP Networking Silicon Introduction RX MAC MdioTX MAC Acpi LED Reference Documents Document ScopeProduct Code 82540EP Networking Silicon Features Benefits PCI FeaturesMAC Specific Features Application flexibility for LAN on Motherboard PHY Specific Features HostOffloading Manageability Features A server management processor Additional Device Features Technology Features Symbol Type Name and Function Signal Type DefinitionsPCI Address, Data and Control Signals PCI Bus Interface IRDY# STS PARFRAME# STS TRDY# STS System Signals Arbitration SignalsInterrupt Signal Error Reporting Signals Impedance Compensation Signals Eeprom and Serial Flash Interface SignalsPower Management Signals SMB Signals LED Signals Miscellaneous SignalsOther Signals XTAL1 AnalogXTAL2 Digital Supplies Test Interface SignalsPower Supply Connections Analog Supplies GND Control SignalsGround and No Connects CTRL15 Absolute Maximum Ratingsa Absolute Maximum RatingsRecommended Operating Conditions Recommended Operating Conditions a Sheet 1 Power Specifications D0a DC SpecificationsDC Characteristics Recommended Operating Conditions a Sheet 2 Power Specifications Dr Uninitialized Power Specifications D3coldPower Specifications Complete Subsystem Symbol Parameter Condition Min Typ Max O Characteristics= V SS AC Characteristics PCI Bus Interface Clock Parameters Timing Specifications PCI Bus InterfaceSymbol Parameter a PCI 66 MHz PCI 33 MHz Units Min Max Tcyc Symbol Parameter PCI 66MHz PCI 33 MHz Units Min Max PCI Bus Interface Timing Parameters VTH Symbol Parameter PCI 66 MHz UnitPCI Bus Interface Timing Measurement Conditions VTL Inch max Point 1kΩ 10 pF PinInch max Point 50 pF Eeprom Interface Link Interface TimingRise and Fall Times Yyww Device Identification82540EP Product Name Date Code Datasheet Package Information Symbol Parameter Value at specified airflow m/s Units Thermal SpecificationsThermal Characteristics Thermal resistance, junction-to-ambient Pinout Information SMB Signals Power Management SignalsImpedance Compensation Signals Eeprom and Serial Flash Interface Signals Digital Power Signals PHY SignalsTest Interface Signals Analog Power Signals Signal Name Pin Grounds and No Connect SignalsSignal Names in Pin Order Sheet 1 Lanpwrgood Smbclk M66EN REQ# CBE3# Signal Names in Pin Order Sheet 2RST# SMBALRT# CLKRUN# Smbdata GND IRDY# FRAME# CBE2# GND Signal Names in Pin Order Sheet 3CLK VIO TRDY# Zpcomp STOP# INTA# DEVSEL# Zncomp Signal Names in Pin Order Sheet 4PAR PERR# GNT# CBE1# Signal Names in Pin Order Sheet 5CBE0# PCIAD5 GND PCIAD1 Clkview FLCE# Eesk PCIAD8 PCIAD6 PCIAD3 PCIAD2 Eecs GND Flso Eedi Signal Names in Pin Order Sheet 6PCIAD9 PCIAD7 PCIAD4 Vddo P12 Visual Pin Reference C D E F G H J K L M N P

82540EP — Networking Silicon

5.2Package Information

Figure 11. 82540EP Mechanical Specifications

Datasheet