Networking Silicon — 82540EP
5.3Thermal Specifications
The 82540EP device is specified for operation when the ambient temperature (TA) is within the range of 0° C to 70° C.
TC (case temperature) is calculated using the equation:
TC = TA + P (θ JA - q JC)
TJ (junction temperature) is calculated using the equation:
TJ = TA + P θ JA
P (power consumption) is calculated by using the typical ICC, as indicated inTable 4 of Section 4.0, and nominal VCC. The thermal resistances are shown in Table 18.
Table 18. Thermal Characteristics
Symbol | Parameter | Value at specified airflow (m/s) | Units | ||||
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θ JA | Thermal resistance, | 28.1 | 25.0 | 23.7 | 22.8 | °C/ | |
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θ JC | Thermal resistance, | 6.1 | 6.1 | 6.1 | 6.1 | °C/ | |
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Thermal resistances are determined empirically with test devices mounted on standard thermal test boards. Real system designs may have different characteristics due to board thickness, arrangement of ground planes, and proximity of other components. The case temperature measurements should be used to assure that the 82540EP device is operating under recommended conditions.
Datasheet | 29 |
