Memory

Memory amounts from 256 MB to 16 GB of DIMM are supported, with a 64/72-bit four-way-interleaved pathway to main memory, which is also located on the module. Therefore, data transfers between MADPs and DIMMs is in four-way interleave fashion. Each of the four DIMMs must be populated in a bank. The 16 slots are divided into four banks of four slots each. They are labeled A through D. Bank A contains DIMM sockets A1, A2, A3, and A4. Banks B, C, and D each contain 4 DIMM sockets and are named in the same fashion. There are silk screens on the module next to each DIMM socket to label its bank number. DIMM banks do not have to be filled in any order, but for best thermal results, you should populate them from A to D. If only one DIMM bank is used, use bank A first, and then B, C, and D.

A3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B4

D3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D4

A1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A2

C1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C2

B1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B2

D1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

D2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X Y Z

OM09919

Figure 3. Memory Module DIMM Installation Sequence

X.One of sixteen DIMM sockets

Y.One of four Memory Address Data Paths (MADP)

Z.Memory Expansion Card Connector (MECC)

Removing the Memory Module

See “Memory” on page 16 for memory size and requirements. The memory module is located on the baseboard as shown in Figure 1 on page 14. The DIMM locations are shown in Figure 3.

1.Observe the safety and ESD precautions at the beginning of this chapter.

2.Remove the memory module from the baseboard:

∙Pull the module upward slightly to disengage it from the baseboard connector.

∙Slide the module straight up and away from the baseboard until it clears the guide rails.

∙Place the module component-side up on a nonconductive, static-free surface.

Removing and Installing Baseboard Components

61