Sony MZ-B10 SECTION SERVICING NOTES, Notes On Laser Diode Emission Check, MAIN Board Side B

MZ-B10

SECTION 1

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (LCX-5R)

The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care.

•In performing the repair with the power supplied to the set, re- moving the MAIN board causes the set to be disabled.

In such a case, make a solder bridge to short SL802 (OPEN CLOSE) on the MAIN board in advance.

– MAIN Board (Side B) –

*

IC801

CSP(Chip Size Package)

SL802

(OPEN/CLOSE)

SL802

(OPEN/CLOSE)

•Handle the FLEXIBLE board (over write head) with care, as it has been soldered directly to the MAIN board.

In repairing the component side of MAIN board, connect the FLEXIBLE board (over write head) and the MAIN board with the lead wires in advance.

	flexible board
laser-tap	(over write head)	case (upper) assy

OPTICAL PICK-UP FLEXIBLE BOARD

MAIN board

•This set requires the patch data in the nonvolatile memory (IC802) to be rewritten, when the nonvolatile memory was re- placed. (See page 30)

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