Mechanical Specifications | Sun Microsystems SME5224AUPA-400

UltraSPARC™-II CPU Module

SME5224AUPA-400400 MHz CPU, 4.0 MB E-Cache

MECHANICAL SPECIFICATIONS

The module components and dimensions are speciﬁed in Figure 6, Figure 7, Figure 8 and Figure 9.

Module Ejectors

CPU/Voltage Regulator Heat Sink

	Thermistor Location (RT0201)
UDB Heat Sinks	Front SRAM Heat Sinks
	Figure 6. CPU Module Components
0.315	6.250 [158.75]
0.315	5.890 [149.61]
[8.00]	0.179 [4.55]

3.680

4.250[93.47]

[107.95]

Pin 328		0.570 [14.48]
		0.570 [14.48]
0.535 [13.59]	Pin 1
0.540 [13.72]	0.112 [2.86 ]	0.174 [4.41]
.200 [5.08]	0.112 [2.86 ]	0.174 [4.41]
3.213 [81.61]	2.551 [64.79]

Dimensions: inches [millimeters]

Figure 7. CPU Module (Component Dimensions)

16

Sun Microsystems, Inc

July 1999

Image 16

Sun Microsystems SME5224AUPA-400 manual Mechanical Specifications, CPU Module Components

Contents

Module Features Module Beneﬁts Module DescriptionEase of System Design Performance CPU Description CPU Features CPU BeneﬁtsUltraSPARC-II CPU External Cache Description Data Buffer DescriptionUltraSPARC-II Data Buffer UDB-II Block Diagram Module Component Overview System Interface UPA Connector PinsUPA Interconnect Module ID Module PowerJtag Interface Signal Description Signal Type Name and FunctionSystem Interface Clock Interface JTAG/Debug Interface Miscellaneous SignalsInitialization Interface Module Clocks System ClocksSystem Clock Distribution Tested CPU to UPA Clock Signal Distribution Electrical Characteristics Symbol Parameter Rating UnitsSymbol Parameter Min Typ Max Units Absolute Maximum Ratings Module Power Consumption DC CharacteristicsSymbol Parameter Conditions Min Typ Max Units UPA Data Bus Spice Model Module System Loading Example for UPADATA, Upaecc Setup and Hold Time Speciﬁcations Upaclk Module ClocksCpuclk Module Clock Clock Buffers Timing Measurement Waveforms Propagation Delay, Output Hold Time SpeciﬁcationsMin Max Unit Mechanical Specifications CPU Module Components CPU Module Side View Thermal Specifications Two Step Approach to Thermal Design Thermal Deﬁnitions and Speciﬁcations Term Deﬁnition Speciﬁcation Comments Temperature Estimating and Measuring Methods Airﬂow Cooling Measurement MethodAir Velocity Speciﬁcations Air Velocity Case Temperature Measuring Method Heatsink Temperature Measuring Method MHz CPU MHz TCK Symbol Parameter Signals Conditions AC Characteristics Jtag TimingJtag Testability Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View Pin UPA Connector PIN Assignments Bottom View Vddcore GND Vddcore GND Vddcore UPAPORTID1 Handling CPU Modules Storage and Shipping SpecificationValue Parameter Conditions Min Typ Ordering Information Document Revision HistoryPart Number CPU Speeds Description Date Document No Change Sun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Speciﬁcations Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Deﬁnitions and Speciﬁcations Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc