STORAGE AND SHIPPING SPECIFICATION
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Parameter | Conditions | Min. | Typ. | Max | Unit |
Temperature | Ambient | – | 90 | °C | |
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Temperature ramp | Ambient | – | – | 10 | °C/min. |
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Shock (shipping) | Drop height on to any edge, corner, or side of | – | – | 21 | inches |
- single module package | shipping box |
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Shock(shipping) | Drop height on to any edge, corner, or side of | – | – | 18 | inches |
- | shipping box |
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HANDLING CPU MODULES
CAUTION: Handle a module by carefully holding it by its edges and by the large CPU heatsink. Do not bump or handle the SRAM heatsinks because this action can cause unseen damage to the solder connections. Always handle modules and other electronic devices in an
26 | Sun Microsystems, Inc | July 1999 |
