Sun Microsystems SME5224AUPA-400 guide

UltraSPARC™-II CPU Module	Advanced Version
400 MHz CPU, 4.0 MB E-Cache	SME5224AUPA-400

Thermal Deﬁnitions and Speciﬁcations

Term	Deﬁnition	Speciﬁcation	Comments
Tj	Maximum device	85 °C,	The Tj can't be measured directly by a thermo-couple
	junction		probe. It must always be estimated as Tj or less. Less is
	temperature		preferred.

Tc	Maximum case	76.7 °C	Measurable at the top-center of the device. Requires a hole
	temperature		in the base of the heatsink to allow the thermocouple to be
			in contact with the case. Maximum case temperature is
			speciﬁed using a CPU device at its maximum power
			dissipation.

Ts	Heatsink	75 °C	Measurable at the temperature of the base of the heatsink.
	temperature		The best approach is to embed a thermocouple in a cavity
			drilled in the heatsink base. An alternative approach is to
			place the thermocouple between the ﬁns/pins of the heat-
			sink (insulated from the airﬂow) and in contact with the
			base plate of the heatsink.

Ta	Module ambient air	see page 20	The air temperature as it approaches the heatsink.
	temperature

Pd	Typical power	19.0 W	The worst case compute loads over the entire process
	dissipation of the		range.
	CPU

θjc	Maximum	0.5°C/W	The speciﬁcation for the UltraSPARC™–II, 400 MHz CPU
	junction-to-case		in a ceramic LGA package.
	thermal resistance
	of the package

θcs	Case-to-heatsink	0.1 °C/W	Accuracy of this value requires that good thermal contact is
	thermal resistance		made between the package and the heatsink.

θsa	Heatsink-to-air	see page 20	This value is dependent on the heatsink design, the airﬂow
	thermal resistance		direction, and the airﬂow velocity.

Va	Air velocity	see page 20	The ducted airﬂow.

July 1999

Sun Microsystems, Inc

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Image 19

Sun Microsystems SME5224AUPA-400 manual Thermal Deﬁnitions and Speciﬁcations, Term Deﬁnition Speciﬁcation Comments

Contents

Performance Module Features Module BeneﬁtsModule Description Ease of System Design CPU Description CPU Features CPU BeneﬁtsUltraSPARC-II CPU External Cache Description Data Buffer DescriptionUltraSPARC-II Data Buffer UDB-II Module Component Overview Block Diagram System Interface UPA Connector PinsUPA Interconnect Module ID Module PowerJtag Interface Clock Interface Signal DescriptionSignal Type Name and Function System Interface JTAG/Debug Interface Miscellaneous SignalsInitialization Interface Tested CPU to UPA Module ClocksSystem Clocks System Clock Distribution Clock Signal Distribution Absolute Maximum Ratings Electrical CharacteristicsSymbol Parameter Rating Units Symbol Parameter Min Typ Max Units Module Power Consumption DC CharacteristicsSymbol Parameter Conditions Min Typ Max Units Module System Loading Example for UPADATA, Upaecc UPA Data Bus Spice Model Clock Buffers Setup and Hold Time SpeciﬁcationsUpaclk Module Clocks Cpuclk Module Clock Timing Measurement Waveforms Propagation Delay, Output Hold Time SpeciﬁcationsMin Max Unit CPU Module Components Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Specifications Term Deﬁnition Speciﬁcation Comments Thermal Deﬁnitions and Speciﬁcations Air Velocity Temperature Estimating and Measuring MethodsAirﬂow Cooling Measurement Method Air Velocity Speciﬁcations Heatsink Temperature Measuring Method Case Temperature Measuring Method MHz CPU MHz TCK Symbol Parameter Signals Conditions AC Characteristics Jtag TimingJtag Testability Jtag Ieee 1149.1 Timing Pin UPA Connector PIN Assignments TOP View Vddcore GND Vddcore GND Vddcore UPAPORTID1 UPA Connector PIN Assignments Bottom View Handling CPU Modules Storage and Shipping SpecificationValue Parameter Conditions Min Typ Date Document No Change Ordering InformationDocument Revision History Part Number CPU Speeds Description Sun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Speciﬁcations Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Deﬁnitions and Speciﬁcations Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc