CPU Module Side View | Sun Microsystems SME5224AUPA-400 manual

Bidirectional Airflow

UltraSPARC™-II CPU Module	Advanced Version
400 MHz CPU, 4.0 MB E-Cache	SME5224AUPA-400

Module

Shroud

Bidirectional

Airflow

Backside SRAM

Heat sink

Figure 8. CPU Module Side View

Provide Minimum Frontside Clearance 0.079 [2.00]

Maximum Card Guide Depth 0.087 [2.201]

0.298

[7.57] Maximum

1.318

[33.48] Maximum

0.062 + 0.008

[1.57 + 0.20]

Provide Minimum 0.079 [2.00] Backside Clearance

Dimensions: inches [millimeters]

Figure 9. CPU Module Side View Dimensions

NOTE: A minimum backside clearance is required for airﬂow cooling of the backside heatsink.

July 1999

Sun Microsystems, Inc

17

Image 45

Sun Microsystems SME5224AUPA-400 manual CPU Module Side View

Contents

Module Description Module Features Module BeneﬁtsEase of System Design Performance CPU Features CPU Beneﬁts CPU DescriptionUltraSPARC-II CPU Data Buffer Description External Cache DescriptionUltraSPARC-II Data Buffer UDB-II Module Component Overview Block Diagram UPA Connector Pins System InterfaceUPA Interconnect Module Power Module IDJtag Interface Signal Type Name and Function Signal DescriptionSystem Interface Clock Interface Miscellaneous Signals JTAG/Debug InterfaceInitialization Interface System Clocks Module ClocksSystem Clock Distribution Tested CPU to UPA Clock Signal Distribution Symbol Parameter Rating Units Electrical CharacteristicsSymbol Parameter Min Typ Max Units Absolute Maximum Ratings DC Characteristics Module Power ConsumptionSymbol Parameter Conditions Min Typ Max Units Module System Loading Example for UPADATA, Upaecc UPA Data Bus Spice Model Upaclk Module Clocks Setup and Hold Time SpeciﬁcationsCpuclk Module Clock Clock Buffers Propagation Delay, Output Hold Time Speciﬁcations Timing Measurement WaveformsMin Max Unit CPU Module Components Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Specifications Term Deﬁnition Speciﬁcation Comments Thermal Deﬁnitions and Speciﬁcations Airﬂow Cooling Measurement Method Temperature Estimating and Measuring MethodsAir Velocity Speciﬁcations Air Velocity Heatsink Temperature Measuring Method Case Temperature Measuring Method AC Characteristics Jtag Timing MHz CPU MHz TCK Symbol Parameter Signals ConditionsJtag Testability Jtag Ieee 1149.1 Timing Pin UPA Connector PIN Assignments TOP View Vddcore GND Vddcore GND Vddcore UPAPORTID1 UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Handling CPU ModulesValue Parameter Conditions Min Typ Document Revision History Ordering InformationPart Number CPU Speeds Description Date Document No Change Sun Microsystems, Inc UltraSPARC -II CPU Module UltraSPARC-II CPU Data Buffer Description Block Diagram System Interface Module ID System Interface JTAG/Debug Interface UPA and CPU Clocks Clock Signal Distribution Absolute Maximum Ratings DC Characteristics UPA Data Bus Spice Model Upaclk Module Clocks Propagation Delay, Output Hold Time Speciﬁcations Mechanical Specifications CPU Module Side View Two Step Approach to Thermal Design Thermal Deﬁnitions and Speciﬁcations Temperature Estimating and Measuring Methods Case Temperature Measuring Method AC Characteristics Jtag Timing Jtag Ieee 1149.1 Timing UPA Connector PIN Assignments TOP View UPA Connector PIN Assignments Bottom View Storage and Shipping Specification Ordering Information Sun Microsystems, Inc