Sun Microsystems SME5224AUPA-400 MECHANICAL SPECIFICATIONS

SME5224AUPA-400 400 MHz CPU, 4.0 MB E-Cache

UltraSPARC™-II CPU Module

July 1999

Sun Microsystems, Inc

MECHANICAL SPECIFICATIONS

The module components and dimensions are speciﬁed inFigure 6,Figure 7,Figure 8 and Figure9.

Figure 6. CPU Module Components

Figure 7. CPU Module (Component Dimensions)

Module Ejectors

CPU/Voltage Regulator Heat Sink

Thermistor Location (RT0201)

UDB Heat Sinks

Front SRAM Heat Sinks

0.179 [4.55]

0.315

[8.00]

4.250

[107.95]

3.680

[93.47]

0.570 [14.48]

0.535 [13.59]

0.540 [13.72]

6.250 [158.75]

3.213 [81.61]

Pin 328

Pin 1

2.551 [64.79]

0.112 [2.86 ] 0.174 [4.41]

5.890 [149.61]

.200 [5.08]

Dimensions: inches [millimeters]

Contents

Main DATASHEET SME5224AUPA-400 UltraSPARC-II CPU Module 400 MHz CPU, 4.0 MB E-Cache MODULE DESCRIPTION Module Features Module Benets CPU D UltraSPARC-II CPU CPU Features CPU Benets D ATA B UFFER D E XTERNAL C ACHE D M ODULE COMPONENT O Block Diagram S YSTEM I Page S IGNAL D System Interface 1. For the modular connector pin assignments (UPA pin-out assignments) see page 24 and page 25. Clock Interface JTAG/Debug Interface Initialization Interface Miscellaneous Signals UPAAND CPU CLOCKS Module Clocks System Clocks System Clock Distribution Page E LECTRICAL C Absolute Maximum Ratings Recommended Operating Conditions Module Power Consumption DC Characteristics UPA Data Bus SPICE Model U P AA CT UPA_CLK Module Clocks CPU_CLK Module Clock Clock Buffers Timing References Timing Measurement Waveforms Figure 5. Timing Measurement Waveforms Propagation Delay, Output Hold Time Specications MECHANICAL SPECIFICATIONS The module components and dimensions are specied inFigure 6,Figure 7,Figure 8 and Figure9. Figure 7. CPU Module (Component Dimensions) Figure 6. CPU Module Components Page T HERMAL S Two Step Approach to Thermal Design Thermal Denitions and Specications Temperature Estimating and Measuring Methods Page SME5224AUPA-400 400 MHz CPU, 4.0 MB E-Cache JTAGT AC Characteristics - JTAG Timing JTAG(IEEE 1149.1) T Figure 10. Voltage Waveforms - Setup and Hold Times Figure 11. Voltage Waveforms - Propagation Delay Times SME5224AUPA-400 400 MHz CPU, 4.0 MB E-Cache UPACONNECTOR PIN ASSIGNMENTS (TOP VIEW) UPACONNECTOR PIN ASSIGNMENTS (BOTTO M VIEW) H ANDLING CPU M S TORAGEAND S HIPPING S ORDERING INFORMATION[1] D OCUMENT R EVISION H Page DATASHEET SME5224AUPA-400 UltraSPARC-II CPU Module 400 MHz CPU, 4.0 MB E-Cache MODULE DESCRIPTION Module Features Module Benets CPU D UltraSPARC-II CPU CPU Features CPU Benets D ATA B UFFER D E XTERNAL C ACHE D M ODULE COMPONENT O Block Diagram S YSTEM I Page 7 S IGNAL D 1. For the modular connector pin assignments (UPA pin-out assignments) see page 24 and page 25. System Interface Clock Interface JTAG/Debug Interface Initialization Interface Miscellaneous Signals UPAAND CPU CLOCKS Module Clocks System Clocks System Clock Distribution Page E LECTRICAL C Absolute Maximum Ratings Recommended Operating Conditions 12 SME5224AUPA-400 400 MHz CPU, 4.0 MB E-Cache Module Power Consumption DC Characteristics UPA Data Bus SPICE Model U P AA CT UPA_CLK Module Clocks CPU_CLK Module Clock Clock Buffers Timing References Timing Measurement Waveforms Figure 5. Timing Measurement Waveforms Propagation Delay, Output Hold Time Specications MECHANICAL SPECIFICATIONS The module components and dimensions are specied inFigure 6,Figure 7,Figure 8 and Figure9. Figure 7. CPU Module (Component Dimensions) Figure 6. CPU Module Components Page T HERMAL S Two Step Approach to Thermal Design Thermal Denitions and Specications Temperature Estimating and Measuring Methods Page JTAGT AC Characteristics - JTAG Timing JTAG(IEEE 1149.1) T Figure 10. Voltage Waveforms - Setup and Hold Times Figure 11. Voltage Waveforms - Propagation Delay Times 24 SME5224AUPA-400 400 MHz CPU, 4.0 MB E-Cache UPACONNECTOR PIN ASSIGNMENTS (TOP VIEW) UPACONNECTOR PIN ASSIGNMENTS (BOTTO M VIEW) H ANDLING CPU M S TORAGEAND S HIPPING S ORDERING INFORMATION[1] D OCUMENT R EVISION H