Sun Microsystems SME5224AUPA-400 manual Absolute Maximum Ratings

UltraSPARC™-II CPU Module	Advanced Version
400 MHz CPU, 4.0 MB E-Cache	SME5224AUPA-400

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings [1]

Symbol	Parameter	Rating	Units
VDD	Supply voltage range for I/O	0 to 3.8	V
VDD_CORE	Supply voltage range for CPU core	0 to 3.0	V
[2]
VI	Input voltage range [3]	-0.5 to VDD + 0.5	V
VO	Output voltage range	-0.5 to VDD + 0.5	V
IIK	Input clamp current	± 20	mA
IOK	Output clamp current	± 50	mA
IOL	Current into any output in the low state	50	mA
TSTG	Storage temperature (non-operating)	-40 to 90	°C

1.Operation of the device at values in excess of those listed above will result in degradation or destruction of the device. All voltages are defined with respect to ground. Functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2.The VDD_CORE supplies voltage to the onboard DC-DC regulator. The onboard DC-DC regulator then powers the CPU core and the SRAM I/O bus interface. The VDD_CORE must be lower than VDD, except when the CPU is being re-cycled, at which time the VDD can be lower than VDD_CORE for 30 ms or less, provided that the current is limited to twice thew maximum CPU rating.

3.Unless otherwise noted, all voltages are with respect to the VSS ground.

Recommended Operating Conditions

Symbol	Parameter	Min	Typ	Max	Units
VDD	Supply voltage for I/O	3.14	3.30	3.46	V
VDD_CORE	Supply voltage for the CPU core [1]	2.47	2.60	2.73	V
VSS	Ground	–	0	–	V
VIH	High-level input voltage	2.0	–	VDD + 0.2	V
VIL	Low-level input voltage	-0.3	–	0.8	V
IOH	High-level output current	–	–	-4	mA
IOL	Low-level output current	–	–	8	mA
TJ	Operating junction temperature	–	–	85	°C
T	Operating ambient temperature	–	–	– [2]	°C
A

1.A current of 2.6V supplies power to the DC-DC regulator which in turn supplies 1.9V to the CPU core.

2.Maximum ambient temperature is limited by airflow such that the maximum junction temperature does not exceed TJ. See the section "Thermal Specifications," on page 18.

July 1999 Sun Microsystems, Inc 11