1.3Features
Enclosure
•Industry 19”
•Storage bays
•Dimensions:
Processors
•Supports Quad AMD® 8000 Opteron™ Socket F processors
Chipset
•NVIDIA nForce Pro 2200 + 2050
Memory
•Sixteen (16)
•Up to 64GB Registered DDR2 667/533/400 DIMMs
•Supports ECC and four rank memory modules
Expansion Slots
•Two (2) x16
•Two (2) x16
•One (1) PCI 32bit/33MHz slot
•Total five (5) usable expansion slots
Back I/O Ports
•Stacked PS/2 Mouse and Keyboard ports
•Stacked two (2) USB 2.0 ports
•One (1) COM1 connector
•One (1)
•Stacked two (2)
•One (1)
Front Panel Features
•I/O
•LED indicators
•Switches
Integrated Storage Controller
•Supports eight (8) ports running up to 3.0Gb/s
Storage
•Supports eight (8) SATA/SATA2 HDD with RAID 1, 0, 1+0, 5
•
Networking
•Total three (3) Gigabit Ethernet ports
Video
•XGI XG20 graphics controller
•16MB Frame Buffer of video memory
Motherboard
•TYAN Thunder S4985G3NR
•SSI footprint (13” x 16”)
BIOS
•PhoenixBIOS 8Mbit LPC Flash ROM
•Serial Console Redirect
•USB device boot
•
•ACPI 2.0 power management support
•Power management: S0, S1, S4, and S5
Server Management
•Automatic system fan speed control
•Chassis intrusion alert
•Supports TYAN Server Management (TSM) and TYAN LCM module
•TYAN SMDC M3291, IPMI v2.0 com- pliant remote server management kit (Option)
System Cooling
•(6) 120x120x38 mm, 4800rpm, hot- swappable redundant fans
•(4) Passive CPU heatsinks
Power Supply
•EPS 12V, 1140W (2+1) redundant
•100V~240V AC input
Regulatory
•FCC Class B (Declaration of Confor- mity)
•CE (Declaration of Conformity)
•VCCI
•
Environment
•Operating temperature 5ºC ~ 35ºC
•
Chapter 1: Overview | 3 |