Intel E8500 manual XMB Package Dimensions Top View

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Packaging Technology

Figure 2-4. XMB Package Dimensions (Top View)

	Handling
	Exclusion		14.02mm.
	Area		8.88mm.
			8.88mm.
	11.73mm.	6.65mm.	XMB
	11.73mm.	6.65mm.	Die
			Die

Die

Keepout

Area

23.50mm. 27.50mm. 37.50mm.

23.50mm.

27.50mm.

37.50mm.

Figure 2-5. XMB Package Dimensions (Side View)

Substrate	Decoup
2.535 ± 0.123 mm	Decoup		Die
2.535 ± 0.123 mm	Cap
2.100 ± 0.121 mm	Cap	0.84 ± 0.05 mm
2.100 ± 0.121 mm		0.84 ± 0.05 mm	0.7 mm Max	0.20 See Note 4
			Seating Plane	0.20 –C–
0.435 ± 0.025 mm			Seating Plane
0.435 ± 0.025 mm				See Note 1
See Note 3				See Note 1
Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® 8500 Chipset North Bridge (NB) and eXternal Memory	13
Bridge (XMB) Thermal/Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Design Flow IntroductionBGA Definition of TermsXMB Reference DocumentsIntroduction TNB Packaging TechnologyNB Package Dimensions Bottom View XMB Package Dimensions Top View Package Mechanical Requirements XMB Package Dimensions Bottom ViewThermal Design Power TDP Thermal SpecificationsDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology Die Case Temperature MeasurementsThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Operating Environment NB Reference Thermal Solution #1Heatsink Performance Mechanical Design Envelope First NB Reference Heatsink Volumetric Envelope Board-Level Components Keepout DimensionsTNBLocation First NB Heatsink Thermal Solution AssemblyExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Thermal Solution AssemblySecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Reference Heatsink Volumetric Envelope XMB Heatsink Thermal Solution AssemblyXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Table A-1 NB Heatsink Thermal Solution #1 Thermal Solution Component SuppliersTable A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Table B-1. Mechanical Drawing List Mechanical DrawingsFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory