Intel manual Intel E8500 Chipset XMB Thermal Specifications

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Thermal Specifications

Table 3-2. Intel® E8500 Chipset XMB Thermal Specifications

Parameter	Value	Notes

Tcase_max	105°C
Tcase_min	5°C
TDPdual channel	9.1W	DDR-266
TDPdual channel	9.3W	DDR-333
TDPdual channel	8.5W	DDR2-400

NOTE:

1.These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

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16	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Introduction Design FlowDefinition of Terms BGAReference Documents XMBIntroduction Packaging Technology TNBNB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical RequirementsThermal Design Power TDP Thermal SpecificationsDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal MetrologyThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Operating Environment NB Reference Thermal Solution #1Heatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric EnvelopeFirst NB Heatsink Thermal Solution Assembly TNBLocationExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric EnvelopeSecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric EnvelopeXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing ListFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory