Intel E8500 manual Figures

	8.5	XMB Heatsink Thermal Solution Assembly		38
		8.5.1	Heatsink Orientation	39
		8.5.2	Extruded Heatsink Profiles	40
		8.5.3	Mechanical Interface Material	40
		8.5.4	Thermal Interface Material	40
		8.5.5	Heatsink Retaining Fastener	40
	8.6	Reliability Guidelines		41
A	Thermal Solution Component Suppliers			43
B	Mechanical Drawings			47

Figures

1-1	Thermal Design Process	8
2-1	NB Package Dimensions (Top View)	11
2-2	NB Package Dimensions (Side View)	11
2-3	NB Package Dimensions (Bottom View)	12
2-4	XMB Package Dimensions (Top View)	13
2-5	XMB Package Dimensions (Side View)	13
2-6	XMB Package Dimensions (Bottom View)	14
5-1	Thermal Solution Decision Flowchart	20
5-2	Zero Degree Angle Attach Heatsink Modifications	20
5-3	Zero Degree Angle Attach Methodology (Top View)	20
6-1	First NB Reference Heatsink Measured Thermal Performance vs.
	Approach Velocity	24
6-2	First NB Reference Heatsink Volumetric Envelope	25
6-3	First NB Heatsink Board Component Keepout	26
6-4	First NB Heatsink Assembly	27
6-5	First NB Heatsink Extrusion Profile	28
7-1	Second NB Reference Heatsink Measured Thermal Performance vs.
	Approach Velocity	32
7-2	Second NB Reference Heatsink Volumetric Envelope	33
7-3	Second NB Heatsink Assembly	34
8-1	XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity	37
8-2	XMB Reference Heatsink Volumetric Envelope	38
8-3	XMB Heatsink Board Component Keepout	39
8-4	XMB Heatsink Assembly	39
8-5	XMB Heatsink Extrusion Profile	41
B-1	NB Heatsink #1 Assembly Drawing	48
B-2	NB Heatsink #1 Drawing	49
B-3	NB Heatsink #2 Assembly Drawing	50
B-4	NB Heatsink #2 Drawing	51
B-5	XMB Heatsink Assembly Drawing	52
B-6	XMB Heatsink Drawing	53

4	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide