Intel E8500 manual Thermal Solution Component Suppliers, Table A-1 NB Heatsink Thermal Solution #1

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AThermal Solution Component Suppliers

Table A-1.

NB Heatsink Thermal Solution #1

 

 

 

 

 

 

 

 

 

 

 

Part

Intel Part Number

 

Supplier

Contact Information

 

 

 

(Part Number)

 

 

 

 

 

 

 

 

 

 

 

Heatsink Assembly includes:

C23120-001

 

CCI/ACK

Harry Lin (USA)

Unidirectional Fin Heatsink

 

 

 

714-739-5797

Thermal Interface Material

 

 

 

hlinack@aol.com

 

 

 

 

Retaining Fastener

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Unidirectional Fin Heatsink

C19221-001

 

CCI/ACK

Harry Lin (USA)

(64.52 x 64.52 x 50.8 mm)

 

 

 

714-739-5797

 

 

 

 

 

 

hlinack@aol.com

 

 

 

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Thermal Interface

689850-001

 

Chomerics

Todd Sousa (USA)

(T710)

 

 

 

(69-12-21937-T710)

360-606-8171

 

 

 

 

 

 

tsousa@parker.com

 

 

 

 

 

Retaining Fastener

-

 

ITW Fastex*

Ron Schmidt (USA)

 

 

 

 

 

(8034-00-9909)

847-299-2222

 

 

 

 

 

 

rschmidt@itwfastex.com

 

 

 

 

 

 

Henry Lu (Taiwan)

 

 

 

 

 

 

(886) 7-811-9206 Ext. 10

 

 

 

 

 

 

henry@mail.itwasia.com.tw

 

 

 

 

 

 

 

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

43

Bridge (XMB) Thermal/Mechanical Design Guide

 

Image 43
Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Design Flow IntroductionBGA Definition of TermsXMB Reference DocumentsIntroduction TNB Packaging TechnologyNB Package Dimensions Bottom View XMB Package Dimensions Top View Package Mechanical Requirements XMB Package Dimensions Bottom ViewThermal Design Power TDP Thermal SpecificationsDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology Die Case Temperature MeasurementsThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Operating Environment NB Reference Thermal Solution #1Heatsink Performance Mechanical Design Envelope First NB Reference Heatsink Volumetric Envelope Board-Level Components Keepout DimensionsTNBLocation First NB Heatsink Thermal Solution AssemblyExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Thermal Solution AssemblySecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Reference Heatsink Volumetric Envelope XMB Heatsink Thermal Solution AssemblyXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Table A-1 NB Heatsink Thermal Solution #1 Thermal Solution Component SuppliersTable A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Table B-1. Mechanical Drawing List Mechanical DrawingsFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory