Thermal Metrology
5.2Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on an E8500 chipset NB component or XMB component when used in conjunction with the 64-bit Intel® Xeon™ processor MP. The combination of the above mentioned processor and the higher bandwidth capability of the E8500 chipsets enable higher levels of system performance. To assess the thermal performance of the chipset thermal solution under “worst-case realistic application” conditions, Intel is developing a software utility that operates the chipset at near worst-case thermal power dissipation.
The power simulation software being developed should only be used to test thermal solutions at or near the thermal design power. Figure 5-1shows a decision flowchart for determining thermal solution needs. Real world applications may exceed the thermal design power limit for transient time periods. For power supply current requirements under these transient conditions, please refer to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact your Intel field sales representative to order the power utility software and user's guide.
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Intel® E8500 Chipset North Bridge (NB) and eXternal Memory | 21 |
Bridge (XMB) Thermal/Mechanical Design Guide | |
