Intel E8500 manual Revision History

Page 6

Revision History

	Document	Revision	Description	Date
	Number	Number	Description	Date
	Number	Number

	306749	001	• Initial release of this document	March 2005

NOTE: Not all revisions may be published.

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6	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Introduction Design FlowDefinition of Terms BGAReference Documents XMBIntroduction Packaging Technology TNBNB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Design Power TDPDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal MetrologyThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology NB Reference Thermal Solution #1 Operating EnvironmentHeatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric EnvelopeFirst NB Heatsink Thermal Solution Assembly TNBLocationExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric EnvelopeSecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric EnvelopeXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing ListFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory