Intel E8500 manual Reliability Guidelines

NB Reference Thermal Solution #1

6.6Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6-2.

Table 6-2. Reliability Guidelines

Test (1)	Requirement	Pass/Fail Criteria (2)
Mechanical	50 g, board level, 11 msec, 3 shocks/axis	Visual Check and Electrical Functional
Shock		Test
Random	7.3 g, board level, 45 min/axis, 50 Hz to	Visual Check and Electrical Functional
Vibration	2000 Hz	Test
Temperature Life	85°C, 2000 hours total, checkpoints at 168,	Visual Check
	500, 1000, and 2000 hours
Thermal Cycling	–5°C to +70°C, 500 cycles	Visual Check
Humidity	85% relative humidity, 55°C, 1000 hours	Visual Check

NOTES:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® E8500 Chipset North Bridge (NB) and eXternal Memory	29
Bridge (XMB) Thermal/Mechanical Design Guide