Intel E8500 manual Table A-2 NB Heatsink Thermal Solution #2

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Thermal Solution Component Suppliers

Table A-2.

NB Heatsink Thermal Solution #2

 

 

 

 

 

 

 

 

 

 

 

Part

Intel Part Number

 

Supplier

Contact Information

 

 

 

 

(Part Number)

 

 

 

 

 

 

 

 

 

 

 

 

Heatsink Assembly includes:

C44148-001

 

CCI/ACK

Harry Lin (USA)

Unidirectional Fin Heatsink

 

 

 

714-739-5797

Thermal Interface Material

 

 

 

hlinack@aol.com

 

 

 

 

Retaining Fastener

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Unidirectional Fin Heatsink

C44147-001

 

CCI/ACK

Harry Lin (USA)

(64.52 x 64.52 x 50.8 mm)

 

 

 

714-739-5797

 

 

 

 

 

 

hlinack@aol.com

 

 

 

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Thermal Interface

689850-001

 

Chomerics

Todd Sousa (USA)

(T710)

 

 

 

(69-12-21937-T710)

360-606-8171

 

 

 

 

 

 

tsousa@parker.com

 

 

 

 

 

Retaining Fastener

-

 

ITW Fastex*

Ron Schmidt (USA)

 

 

 

 

 

(8047-00-9909)

847-299-2222

 

 

 

 

 

 

rschmidt@itwfastex.com

 

 

 

 

 

 

Henry Lu (Taiwan)

 

 

 

 

 

 

(886) 7-811-9206 Ext. 10

 

 

 

 

 

 

henry@mail.itwasia.com.tw

 

 

 

 

 

 

 

Table A-3.

XMB Heatsink Thermal Solution

 

 

 

 

 

 

 

 

 

 

 

Part

Intel Part Number

 

Supplier

Contact Information

 

 

 

(Part Number)

 

 

 

 

 

 

 

 

 

 

 

Heatsink Assembly includes:

C23124-001

 

CCI/ACK

Harry Lin (USA)

Unidirectional Fin Heatsink

 

 

 

714-739-5797

Thermal Interface Material

 

 

 

hlinack@aol.com

 

 

 

 

Retaining Fastener

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Unidirectional Fin Heatsink

C19222-001

 

CCI/ACK

Harry Lin (USA)

(64.52 x 64.52 x 50.8 mm)

 

 

 

714-739-5797

 

 

 

 

 

 

hlinack@aol.com

 

 

 

 

 

 

Monica Chih (Taiwan)

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

Thermal Interface

689850-001

 

Chomerics

Todd Sousa (USA)

(T-710)

 

 

 

(69-12-22000-T710)

360-606-8171

 

 

 

 

 

 

tsousa@parker.com

 

 

 

 

 

 

 

44

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

 

Bridge (XMB) Thermal/Mechanical Design Guide

Image 44
Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Introduction Design FlowDefinition of Terms BGAReference Documents XMBIntroduction Packaging Technology TNBNB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical RequirementsDie Case Temperature Specifications Thermal SpecificationsThermal Design Power TDP Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal MetrologyThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Heatsink Performance NB Reference Thermal Solution #1Operating Environment Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric EnvelopeFirst NB Heatsink Thermal Solution Assembly TNBLocationExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric EnvelopeSecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric EnvelopeXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing ListFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory