Intel
E8500
manual
XMB Reference Thermal Solution
Specification
Second NB Heatsink Assembly
Power Simulation Software
XMB Reference Thermal Solution
Page 42
XMB Reference Thermal Solution
42
Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Page 41
Page 43
Image 42
Page 41
Page 43
Contents
Thermal/Mechanical Design Guide
Intel E8500 Chipset North Bridge NB and eXternal Memory
Contents
Figures
Tables
Revision History
Introduction
Design Flow
Definition of Terms
BGA
Reference Documents
XMB
Introduction
Packaging Technology
TNB
NB Package Dimensions Bottom View
XMB Package Dimensions Top View
XMB Package Dimensions Bottom View
Package Mechanical Requirements
Thermal Specifications
Thermal Design Power TDP
Die Case Temperature Specifications
Intel E8500 Chipset XMB Thermal Specifications
Thermal Simulation
Thermal Simulation
Die Case Temperature Measurements
Thermal Metrology
Thermal Solution Decision Flowchart
Power Simulation Software
Thermal Metrology
NB Reference Thermal Solution #1
Operating Environment
Heatsink Performance
Mechanical Design Envelope
Board-Level Components Keepout Dimensions
First NB Reference Heatsink Volumetric Envelope
First NB Heatsink Thermal Solution Assembly
TNBLocation
Extruded Heatsink Profiles
Heatsink Retaining Fastener
Reliability Guidelines
Reliability Guidelines
NB Reference Thermal Solution #1
NB Reference Thermal Solution #2
NB Reference Thermal Solution #2
Second NB Heatsink Thermal Solution Assembly
Second NB Reference Heatsink Volumetric Envelope
Second NB Heatsink Assembly
Please refer to .6 for detail
NB Reference Thermal Solution #2
XMB Reference Thermal Solution
XMB Heatsink Thermal Solution Assembly
XMB Reference Heatsink Volumetric Envelope
XMB Location
Extruded Heatsink Profiles
XMB Heatsink Extrusion Profile
XMB Reference Thermal Solution
Thermal Solution Component Suppliers
Table A-1 NB Heatsink Thermal Solution #1
Table A-2 NB Heatsink Thermal Solution #2
Table A-3 XMB Heatsink Thermal Solution
Thermal Solution Component Suppliers
Mechanical Drawings
Table B-1. Mechanical Drawing List
Figure B-1. NB Heatsink #1 Assembly Drawing
Figure B-2. NB Heatsink #1 Drawing
Figure B-3. NB Heatsink #2 Assembly Drawing
Figure B-4. NB Heatsink #2 Drawing
Figure B-5. XMB Heatsink Assembly Drawing
Figure B-6. XMB Heatsink Drawing
Intel E8500 Chipset North Bridge NB and eXternal Memory
Related pages
All Solution page
06 Résolution des problèmes et entretien for Samsung UE55NU8000TXZG
Solution for La Crosse Technology WS-7213U
Solution for Bissell BS-9400F
Possible Solution for Electrolux EKG5547
07 Résolution des problèmes et entretien for Samsung UE75NU8005TXXC
Resolution & Preset Modes for Philips 170B5
Situation Solution for HANNspree Liquid Crystal Display Television
Solution for Philips SL400i/37
SOLUTION for Enerco 3500DF
Are there any compatibility issues with the
Honeywell V9055A1055
?
Top
Page
Image
Contents