Intel
E8500
manual
XMB Reference Thermal Solution
Specification
Second NB Heatsink Assembly
Power Simulation Software
XMB Reference Thermal Solution
Page 42
XMB Reference Thermal Solution
42
Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
Page 41
Page 43
Image 42
Page 41
Page 43
Contents
Thermal/Mechanical Design Guide
Intel E8500 Chipset North Bridge NB and eXternal Memory
Contents
Figures
Tables
Revision History
Introduction
Design Flow
Definition of Terms
BGA
Reference Documents
XMB
Introduction
Packaging Technology
TNB
NB Package Dimensions Bottom View
XMB Package Dimensions Top View
XMB Package Dimensions Bottom View
Package Mechanical Requirements
Thermal Specifications
Thermal Design Power TDP
Die Case Temperature Specifications
Intel E8500 Chipset XMB Thermal Specifications
Thermal Simulation
Thermal Simulation
Die Case Temperature Measurements
Thermal Metrology
Thermal Solution Decision Flowchart
Power Simulation Software
Thermal Metrology
NB Reference Thermal Solution #1
Operating Environment
Heatsink Performance
Mechanical Design Envelope
Board-Level Components Keepout Dimensions
First NB Reference Heatsink Volumetric Envelope
First NB Heatsink Thermal Solution Assembly
TNBLocation
Extruded Heatsink Profiles
Heatsink Retaining Fastener
Reliability Guidelines
Reliability Guidelines
NB Reference Thermal Solution #1
NB Reference Thermal Solution #2
NB Reference Thermal Solution #2
Second NB Heatsink Thermal Solution Assembly
Second NB Reference Heatsink Volumetric Envelope
Second NB Heatsink Assembly
Please refer to .6 for detail
NB Reference Thermal Solution #2
XMB Reference Thermal Solution
XMB Heatsink Thermal Solution Assembly
XMB Reference Heatsink Volumetric Envelope
XMB Location
Extruded Heatsink Profiles
XMB Heatsink Extrusion Profile
XMB Reference Thermal Solution
Thermal Solution Component Suppliers
Table A-1 NB Heatsink Thermal Solution #1
Table A-2 NB Heatsink Thermal Solution #2
Table A-3 XMB Heatsink Thermal Solution
Thermal Solution Component Suppliers
Mechanical Drawings
Table B-1. Mechanical Drawing List
Figure B-1. NB Heatsink #1 Assembly Drawing
Figure B-2. NB Heatsink #1 Drawing
Figure B-3. NB Heatsink #2 Assembly Drawing
Figure B-4. NB Heatsink #2 Drawing
Figure B-5. XMB Heatsink Assembly Drawing
Figure B-6. XMB Heatsink Drawing
Intel E8500 Chipset North Bridge NB and eXternal Memory
Related pages
All Solution page
Condition Suggested solutions Scanner does not work for Samsung CLX4195FW
Solutions for Compaq 700 Series
Computer will not turn on Cause Solution for HP dx2400
Dépannage Symptôme Problème Possible Solution for Altec Lansing IM4
Total Streaming Solution for Apple QuickTime Streaming Server Darwin Streaming Server
Solutions for Intel 05-2352-005
Solution for Bissell BS-9400F
Solution 5 Print a self-test report for HP C5500
Situation Solution for SRS Labs MAC-001149
Résolution des problèmes et entretien for Samsung UE48JU7590TXZG
Are there any compatibility issues with the
Honeywell V9055A1055
?
Top
Page
Image
Contents