Intel E8500 manual Heatsink Retaining Fastener

NB Reference Thermal Solution #1

the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in Table 6-1The heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C inch2/W.

Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure

Pressure (psi)	Thermal Resistance (°C × in2)/W
5	0.37
10	0.30
20	0.21
30	0.17

NOTE:

1.All measured at 50°C.

6.5.5Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes. These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.

Figure 6-5. First NB Heatsink Extrusion Profile

28	Intel® E8500 Chipset North Bridge (NB) and eXternal Memory
	Bridge (XMB) Thermal/Mechanical Design Guide