Intel E8500 manual XMB Location

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XMB Reference Thermal Solution

Full mechanical drawings of the thermal solution assembly and the heatsink are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

Figure 8-3. XMB Heatsink Board Component Keepout

4X Ø 5.5mm

63.500mm.
55.250mm.
37.500mm.
37.5mm
XMB Location	38.097mm. 48.260mm.

4X Ø 2.95 ± 0.0254mm

No Component Keep Out Area

2.48mm Max Component Height

Heatsink Mounting Hole

8.5.1Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.

Figure 8-4. XMB Heatsink Assembly

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory	39
Bridge (XMB) Thermal/Mechanical Design Guide

Image 39

Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Design Flow IntroductionBGA Definition of TermsXMB Reference DocumentsIntroduction TNB Packaging TechnologyNB Package Dimensions Bottom View XMB Package Dimensions Top View Package Mechanical Requirements XMB Package Dimensions Bottom ViewThermal Specifications Thermal Design Power TDPDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Thermal Metrology Die Case Temperature MeasurementsThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology NB Reference Thermal Solution #1 Operating EnvironmentHeatsink Performance Mechanical Design Envelope First NB Reference Heatsink Volumetric Envelope Board-Level Components Keepout DimensionsTNBLocation First NB Heatsink Thermal Solution AssemblyExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Reference Heatsink Volumetric Envelope Second NB Heatsink Thermal Solution AssemblySecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Reference Heatsink Volumetric Envelope XMB Heatsink Thermal Solution AssemblyXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Table A-1 NB Heatsink Thermal Solution #1 Thermal Solution Component SuppliersTable A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Table B-1. Mechanical Drawing List Mechanical DrawingsFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory