Intel E8500 Thermal Specifications, Thermal Design Power TDP, Die Case Temperature Specifications

3Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the E8500 chipset NB/XMB components to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1for the E8500 chipset NB component and Table 3-2for the E8500 chipset XMB component FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for one or more heatsinks when using the E8500 chipsets NB/XMB components.

3.2Die Case Temperature Specifications

To ensure proper operation and reliability of the E8500 chipset NB/XMB components, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1and Table 3-2. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® E8500 Chipset NB Thermal Specifications

Parameter	Value	Notes
Tcase_max	104°C
Tcase_min	5°C
TDPwith 1 XMB attached	17.9W
TDPwith 2 XMBs attached	19.8W
TDPwith 3 XMBs attached	22.4W
TDPwith 4 XMBs attached	24.5W

NOTE:

1.These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

Intel® E8500 Chipset North Bridge (NB) and eXternal Memory	15
Bridge (XMB) Thermal/Mechanical Design Guide