Intel E8500 manual Extruded Heatsink Profiles

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XMB Reference Thermal Solution

8.5.2Extruded Heatsink Profiles

The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB. Figure 8-5shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix B.

8.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

8.5.4Thermal Interface Material

A TIM provides improved conductivity between the die and the heatsink. The reference thermal solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm (0.7 in. x 0.7 in.) square.

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.

8.5.4.1Effect of Pressure on TIM Performance

Please refer to Section 6.5.4.1 for detail.

8.5.5Heatsink Retaining Fastener

The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B for a mechanical drawing of the fastener.

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Intel® E8500 Chipset North Bridge (NB) and eXternal Memory

 

Bridge (XMB) Thermal/Mechanical Design Guide

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Contents Thermal/Mechanical Design Guide Intel E8500 Chipset North Bridge NB and eXternal Memory Contents Figures Tables Revision History Introduction Design FlowDefinition of Terms BGAReference Documents XMBIntroduction Packaging Technology TNBNB Package Dimensions Bottom View XMB Package Dimensions Top View XMB Package Dimensions Bottom View Package Mechanical RequirementsThermal Design Power TDP Thermal SpecificationsDie Case Temperature Specifications Intel E8500 Chipset XMB Thermal Specifications Thermal Simulation Thermal Simulation Die Case Temperature Measurements Thermal MetrologyThermal Solution Decision Flowchart Power Simulation Software Thermal Metrology Operating Environment NB Reference Thermal Solution #1Heatsink Performance Mechanical Design Envelope Board-Level Components Keepout Dimensions First NB Reference Heatsink Volumetric EnvelopeFirst NB Heatsink Thermal Solution Assembly TNBLocationExtruded Heatsink Profiles Heatsink Retaining Fastener Reliability Guidelines Reliability GuidelinesNB Reference Thermal Solution #1 NB Reference Thermal Solution #2 NB Reference Thermal Solution #2 Second NB Heatsink Thermal Solution Assembly Second NB Reference Heatsink Volumetric EnvelopeSecond NB Heatsink Assembly Please refer to .6 for detail NB Reference Thermal Solution #2 XMB Reference Thermal Solution XMB Heatsink Thermal Solution Assembly XMB Reference Heatsink Volumetric EnvelopeXMB Location Extruded Heatsink Profiles XMB Heatsink Extrusion Profile XMB Reference Thermal Solution Thermal Solution Component Suppliers Table A-1 NB Heatsink Thermal Solution #1Table A-2 NB Heatsink Thermal Solution #2 Table A-3 XMB Heatsink Thermal Solution Thermal Solution Component Suppliers Mechanical Drawings Table B-1. Mechanical Drawing ListFigure B-1. NB Heatsink #1 Assembly Drawing Figure B-2. NB Heatsink #1 Drawing Figure B-3. NB Heatsink #2 Assembly Drawing Figure B-4. NB Heatsink #2 Drawing Figure B-5. XMB Heatsink Assembly Drawing Figure B-6. XMB Heatsink Drawing Intel E8500 Chipset North Bridge NB and eXternal Memory
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